1. Overlap of pads
1) Pads overlapping (except for surface mount pads) result in holes overlapping, causing drill bits to break due to multiple drilling in the same spot during the PCB manufacturing process, leading to hole damage.
2) When two holes in the middle overlap, such as one hole being an isolation pad and the other hole being a connection pad (flower pad), misinterpretation may occur, resulting in scrap.
2. Abuse of layers
1) Making unnecessary connections on graphic layers when originally designed for more than five circuit layers can lead to confusion.
2) It is important to carefully set up the layer mapping. For example, when using software like Prol, utilize the Board layer to draw lines on each layer and mark them accordingly. By ensuring that the Board layer is selected, data transfer errors can be avoided and design clarity maintained.
3) Deviating from conventional design practices, such as placing component surfaces on the Bottom layer and copper surfaces on the Top layer, can lead to inconvenience and errors.
3. The random placement of characters
1) The placement of character cover pads for SMD solder tabs can create inconvenience during the on-off testing of the printed circuit board and component soldering.
2) Characters designed too small can make screen printing difficult, while characters that are too large may overlap and become difficult to distinguish.
4. The setting of the single-sided pad aperture
1) Single-sided pads are generally not drilled, but if drill holes need to be marked, they should be designed with a diameter of zero to prevent issues with drill coordinates during data generation.
2) Special markings should be used for single-sided pads with drilled holes.
5. Drawing pads with filled blocks
While drawing pads with filled blocks may pass DRC inspection during circuit design, it may not be suitable for processing, making it difficult to generate solder mask data directly from the pads and leading to challenges in device soldering.
6. The electrical stratum as both a flower pad and a connection
The design of power supplies in the form of flower pads may cause the ground plane to be opposite on the printed board and all connections to be isolated lines, which the designer must be aware of. Care should be taken when drawing isolation lines for multiple power source or ground groups to prevent gaps that could lead to short circuits or sealed connection areas.
7. The definition of processing levels is unclear
1) Single-panel designs on the TOP layer may cause difficulties in soldering the manufactured board if front and back are not specified.
2) For example, a four-layer board designed with TOP, mid1, mid2, and bottom layers needs clear processing order explanations to avoid confusion.
8. Excessive padding blocks or thin line-filled padding blocks in the design
1) Excessive padding blocks or thin line filling can result in incomplete light drawing data.
2) Drawing filled blocks individually during light drawing data processing increases the amount of data generated, making data processing more difficult.
9. Surface mount device pad length
For densely packed surface mount devices, test pin installation may be impacted by short pad lengths, leading to incorrect test pin positions even though device installation remains unaffected.
10. Small spacing of large-area grids
Grid line edges within a large area should be at least 0.3mm to prevent broken films from attaching to the board during printing, causing broken lines.
11. Close proximity of large copper foil areas to the outer frame
Large copper foil areas should be at least 0.2mm away from the outer frame to prevent warping or solder resist detachment during milling.
12. Uneven graphic design
Uneven plating layers in the graphic design process can affect overall quality.
13. Using grid lines for large copper areas to avoid PCB board blistering.
1) Pads overlapping (except for surface mount pads) result in holes overlapping, causing drill bits to break due to multiple drilling in the same spot during the PCB manufacturing process, leading to hole damage.
2) When two holes in the middle overlap, such as one hole being an isolation pad and the other hole being a connection pad (flower pad), misinterpretation may occur, resulting in scrap.
2. Abuse of layers
1) Making unnecessary connections on graphic layers when originally designed for more than five circuit layers can lead to confusion.
2) It is important to carefully set up the layer mapping. For example, when using software like Prol, utilize the Board layer to draw lines on each layer and mark them accordingly. By ensuring that the Board layer is selected, data transfer errors can be avoided and design clarity maintained.
3) Deviating from conventional design practices, such as placing component surfaces on the Bottom layer and copper surfaces on the Top layer, can lead to inconvenience and errors.
3. The random placement of characters
1) The placement of character cover pads for SMD solder tabs can create inconvenience during the on-off testing of the printed circuit board and component soldering.
2) Characters designed too small can make screen printing difficult, while characters that are too large may overlap and become difficult to distinguish.
4. The setting of the single-sided pad aperture
1) Single-sided pads are generally not drilled, but if drill holes need to be marked, they should be designed with a diameter of zero to prevent issues with drill coordinates during data generation.
2) Special markings should be used for single-sided pads with drilled holes.
5. Drawing pads with filled blocks
While drawing pads with filled blocks may pass DRC inspection during circuit design, it may not be suitable for processing, making it difficult to generate solder mask data directly from the pads and leading to challenges in device soldering.
6. The electrical stratum as both a flower pad and a connection
The design of power supplies in the form of flower pads may cause the ground plane to be opposite on the printed board and all connections to be isolated lines, which the designer must be aware of. Care should be taken when drawing isolation lines for multiple power source or ground groups to prevent gaps that could lead to short circuits or sealed connection areas.
7. The definition of processing levels is unclear
1) Single-panel designs on the TOP layer may cause difficulties in soldering the manufactured board if front and back are not specified.
2) For example, a four-layer board designed with TOP, mid1, mid2, and bottom layers needs clear processing order explanations to avoid confusion.
8. Excessive padding blocks or thin line-filled padding blocks in the design
1) Excessive padding blocks or thin line filling can result in incomplete light drawing data.
2) Drawing filled blocks individually during light drawing data processing increases the amount of data generated, making data processing more difficult.
9. Surface mount device pad length
For densely packed surface mount devices, test pin installation may be impacted by short pad lengths, leading to incorrect test pin positions even though device installation remains unaffected.
10. Small spacing of large-area grids
Grid line edges within a large area should be at least 0.3mm to prevent broken films from attaching to the board during printing, causing broken lines.
11. Close proximity of large copper foil areas to the outer frame
Large copper foil areas should be at least 0.2mm away from the outer frame to prevent warping or solder resist detachment during milling.
12. Uneven graphic design
Uneven plating layers in the graphic design process can affect overall quality.
13. Using grid lines for large copper areas to avoid PCB board blistering.
