9. Asymmetry
a.) Appearance Characteristics: Solder fails to flow onto the pad adequately.
b.) Hazards: Insufficient strength.
c.) Possible Causes:
— Poor solder fluidity.
— Inadequate flux or subpar quality.
— Insufficient heating.
10. Loose
a.) Appearance Characteristics: Wire or component lead exhibits movement.
b.) Hazards: Poor or non-conduction.
c.) Possible Causes:
— Leads shifting before solder solidifies, creating voids.
— Leads not properly processed (insufficient wetting).
11. Sharpen the Tip
a.) Appearance Characteristics: Tip is exposed.
b.) Hazards: Poor appearance, prone to bridging.
c.) Possible Causes:
— Insufficient flux and prolonged heating.
— Incorrect soldering iron angle.
12. Bridge
a.) Appearance Characteristics: Adjacent wires are connected.
b.) Hazards: Electrical short circuit.
c.) Possible Causes:
— Excessive solder.
— Incorrect soldering iron angle.
13. Pinhole
a.) Appearance Characteristics: Holes visible upon visual inspection or under low-power amplifier.
b.) Hazards: Insufficient strength, prone to corrosion.
c.) Possible Causes:
— Excessive gap between lead and pad hole.
— 14. Bubbles
a.) Appearance Characteristics: Solder bulges at the base of the lead, concealing a cavity.
b.) Hazards: Temporary conduction, potential for long-term poor conduction.
c.) Possible Causes:
— Large gap between lead and pad hole.
— Inadequate lead penetration.
— Prolonged soldering time for double-sided board plugging through holes, causing air expansion within the hole.
15. Copper Foil is Upturned
a.) Appearance Characteristics: Copper foil peels off from the printed board.
b.) Hazards: Damage to the printed board.
c.) Possible Causes:
— Excessive soldering time and high temperature.
16. Stripping
a.) Appearance Characteristics: Solder joints separate from the copper foil (not the copper foil separating from the printed board).
b.) Hazards: Open circuit.
c.) Possible Causes:
— Poor metal plating on the pad.
a.) Appearance Characteristics: Solder fails to flow onto the pad adequately.
b.) Hazards: Insufficient strength.
c.) Possible Causes:
— Poor solder fluidity.
— Inadequate flux or subpar quality.
— Insufficient heating.
10. Loose
a.) Appearance Characteristics: Wire or component lead exhibits movement.
b.) Hazards: Poor or non-conduction.
c.) Possible Causes:
— Leads shifting before solder solidifies, creating voids.
— Leads not properly processed (insufficient wetting).
11. Sharpen the Tip
a.) Appearance Characteristics: Tip is exposed.
b.) Hazards: Poor appearance, prone to bridging.
c.) Possible Causes:
— Insufficient flux and prolonged heating.
— Incorrect soldering iron angle.
12. Bridge
a.) Appearance Characteristics: Adjacent wires are connected.
b.) Hazards: Electrical short circuit.
c.) Possible Causes:
— Excessive solder.
— Incorrect soldering iron angle.
13. Pinhole
a.) Appearance Characteristics: Holes visible upon visual inspection or under low-power amplifier.
b.) Hazards: Insufficient strength, prone to corrosion.
c.) Possible Causes:
— Excessive gap between lead and pad hole.
— 14. Bubbles
a.) Appearance Characteristics: Solder bulges at the base of the lead, concealing a cavity.
b.) Hazards: Temporary conduction, potential for long-term poor conduction.
c.) Possible Causes:
— Large gap between lead and pad hole.
— Inadequate lead penetration.
— Prolonged soldering time for double-sided board plugging through holes, causing air expansion within the hole.
15. Copper Foil is Upturned
a.) Appearance Characteristics: Copper foil peels off from the printed board.
b.) Hazards: Damage to the printed board.
c.) Possible Causes:
— Excessive soldering time and high temperature.
16. Stripping
a.) Appearance Characteristics: Solder joints separate from the copper foil (not the copper foil separating from the printed board).
b.) Hazards: Open circuit.
c.) Possible Causes:
— Poor metal plating on the pad.
