1. As consumers’ demands for smaller sizes and faster speeds continue to increase, solving the heat dissipation problem in printed circuit boards (PCBs) with growing density presents significant challenges.
2. As stacked microprocessors and logic cells approach GHz operating frequencies, cost-effective thermal management has become a top priority for engineers across design, packaging, and materials fields.
3. The trend toward manufacturing 3D ICs to achieve higher functional density has further compounded the challenges of thermal management.
4. Simulation results indicate that a 10°C rise in temperature can double the thermal density of a 3D IC chip, potentially reducing its performance by more than one-third.
1. The International Semiconductor Technology Blueprint (ITRS) forecasts that, within the next three years, interconnect traces in hard-to-cool areas of microprocessors will consume up to 80% of chip power. Thermal Design Power (TDP) is an index used to evaluate a microprocessor’s heat dissipation capability. It defines the heat released when the processor operates at maximum load and the corresponding case temperature.
2. Large data centers with hundreds of computer servers are particularly vulnerable to heat dissipation issues. Estimates suggest that the cooling fan in servers, which can consume up to 15% of the electricity, has become a significant heat source itself. Additionally, cooling costs for data centers may account for 40% to 50% of their total power consumption. These facts necessitate advanced local and remote temperature detection and fan control.
3. Thermal management challenges will intensify with the installation of PCBs containing multi-core processors. Although each processor core may consume less power and dissipate less heat than a single-core processor, the net effect is increased heat dissipation in large computer servers. In essence, running more processor cores within a given PCB area contributes to greater overall heat output.
4. Another significant issue in IC thermal management involves hot spots on chip packaging, where heat flux can reach up to 1000W/cm2, making it challenging to monitor.
5. The PCB plays a crucial role in thermal management, necessitating careful thermal design layout. Design engineers should position high-power components as far apart from each other as possible and away from the PCB corners to maximize the area available for heat dissipation and improve thermal management.
6. Soldering exposed power pads to the PCB is a common practice. Typically, exposed pad type power pads can conduct approximately 80% of the heat generated through the bottom of the IC package into the PCB, with the remaining heat dissipated through the package’s sides and leads.
2. As stacked microprocessors and logic cells approach GHz operating frequencies, cost-effective thermal management has become a top priority for engineers across design, packaging, and materials fields.
3. The trend toward manufacturing 3D ICs to achieve higher functional density has further compounded the challenges of thermal management.
4. Simulation results indicate that a 10°C rise in temperature can double the thermal density of a 3D IC chip, potentially reducing its performance by more than one-third.
1. The International Semiconductor Technology Blueprint (ITRS) forecasts that, within the next three years, interconnect traces in hard-to-cool areas of microprocessors will consume up to 80% of chip power. Thermal Design Power (TDP) is an index used to evaluate a microprocessor’s heat dissipation capability. It defines the heat released when the processor operates at maximum load and the corresponding case temperature.
2. Large data centers with hundreds of computer servers are particularly vulnerable to heat dissipation issues. Estimates suggest that the cooling fan in servers, which can consume up to 15% of the electricity, has become a significant heat source itself. Additionally, cooling costs for data centers may account for 40% to 50% of their total power consumption. These facts necessitate advanced local and remote temperature detection and fan control.
3. Thermal management challenges will intensify with the installation of PCBs containing multi-core processors. Although each processor core may consume less power and dissipate less heat than a single-core processor, the net effect is increased heat dissipation in large computer servers. In essence, running more processor cores within a given PCB area contributes to greater overall heat output.
4. Another significant issue in IC thermal management involves hot spots on chip packaging, where heat flux can reach up to 1000W/cm2, making it challenging to monitor.
5. The PCB plays a crucial role in thermal management, necessitating careful thermal design layout. Design engineers should position high-power components as far apart from each other as possible and away from the PCB corners to maximize the area available for heat dissipation and improve thermal management.
6. Soldering exposed power pads to the PCB is a common practice. Typically, exposed pad type power pads can conduct approximately 80% of the heat generated through the bottom of the IC package into the PCB, with the remaining heat dissipated through the package’s sides and leads.
