Common Defects in PCB Manufacturing and Storage
- Temperature: Fluctuations in temperature can cause component failure.
- Moisture: Exposure to moisture leads to short circuits and corrosion.
- Contaminants: Pollutants and dust can impact PCB performance.
- Impact: Improper handling can damage PCB alignment and soldering processes.
Common PCB soldering defects include open-circuit joints, excessive soldering, component displacement, and more. Methods to detect defects include visual inspection, X-RAY, AOI, FCT, and ICT inspections. Visual inspection identifies manufacturing defects, X-RAY checks internal structures, AOI detects dimensional issues, FCT tests functionality, and ICT evaluates electrical performance.
Methods for Detecting PCB Defects
- Visual Inspection
- X-RAY Inspection
- AOI Inspection
- FCT Inspection
- ICT Inspection
Visual Inspection
Visual inspection is a common method to identify manufacturing defects in PCBs.
X-RAY Inspection
X-RAY inspection checks internal structures without damaging the PCB.
AOI Inspection
AOI inspection detects dimensional defects in PCBs.
FCT Inspection
FCT inspection tests functionality under real conditions.
ICT Inspection
ICT inspection evaluates the electrical performance of PCBs.