1. Minimize the length of wire leads between pins.
Signal radiation intensity correlates directly with signal line length. Longer leads on high-frequency signals increase susceptibility to coupling with nearby elements, elevating device performance. Therefore, for high-frequency signal lines like signal clocks, crystal oscillators, DDR data lines, LVDS lines, USB lines, HDMI lines, etc., it’s imperative to keep traces as short as possible.
2. Limit the number of bends in wire leads.
Ideally, high-frequency circuit board wiring should be predominantly straight, with bends executed using 45-degree angles or gentle arcs. This approach enhances the structural integrity of the high-frequency circuit board, reducing external emissions and signal interference.
3. Segregate ground wires for high-frequency digital and analog signals.
When integrating analog and digital ground wires with a common ground, employ high-frequency choke magnetic beads for connection or opt for direct isolation, ensuring a suitable single-point interconnection. Ground potentials for high-frequency digital signal ground wires often exhibit variance, leading to potential voltage differences. Moreover, these ground wires typically carry rich harmonic components of high-frequency signals. Directly connecting digital signal ground wires with analog signal ground wires can result in high-frequency signal harmonics interfering with analog signals via ground wire coupling. Hence, it’s advisable to isolate ground wires for high-frequency digital and analog signals, utilizing single-point interconnection or high-frequency choke magnetic beads for interconnection.
4. Prevent formation of wiring loops.
Strive to avoid the creation of loops in all high-frequency signal traces. In unavoidable circumstances, minimize loop area as much as possible.
5. Minimize alternation of lead layers between pins on the high-frequency circuit board device.
Reducing the use of vias during component connection is crucial. Each via introduces approximately 0.5pF distributed capacitance. By minimizing the number of vias, signal speed can significantly increase while reducing the likelihood of data errors.
6. Incorporate high-frequency decoupling capacitors at integrated circuit block power supply pins.
Attach a high-frequency decoupling capacitor adjacent to each power supply pin of the integrated circuit block. Augmenting the high-frequency decoupling capacitor at power supply pins effectively mitigates interference from high-frequency harmonics on these pins.
Signal radiation intensity correlates directly with signal line length. Longer leads on high-frequency signals increase susceptibility to coupling with nearby elements, elevating device performance. Therefore, for high-frequency signal lines like signal clocks, crystal oscillators, DDR data lines, LVDS lines, USB lines, HDMI lines, etc., it’s imperative to keep traces as short as possible.
2. Limit the number of bends in wire leads.
Ideally, high-frequency circuit board wiring should be predominantly straight, with bends executed using 45-degree angles or gentle arcs. This approach enhances the structural integrity of the high-frequency circuit board, reducing external emissions and signal interference.
3. Segregate ground wires for high-frequency digital and analog signals.
When integrating analog and digital ground wires with a common ground, employ high-frequency choke magnetic beads for connection or opt for direct isolation, ensuring a suitable single-point interconnection. Ground potentials for high-frequency digital signal ground wires often exhibit variance, leading to potential voltage differences. Moreover, these ground wires typically carry rich harmonic components of high-frequency signals. Directly connecting digital signal ground wires with analog signal ground wires can result in high-frequency signal harmonics interfering with analog signals via ground wire coupling. Hence, it’s advisable to isolate ground wires for high-frequency digital and analog signals, utilizing single-point interconnection or high-frequency choke magnetic beads for interconnection.
4. Prevent formation of wiring loops.
Strive to avoid the creation of loops in all high-frequency signal traces. In unavoidable circumstances, minimize loop area as much as possible.
5. Minimize alternation of lead layers between pins on the high-frequency circuit board device.
Reducing the use of vias during component connection is crucial. Each via introduces approximately 0.5pF distributed capacitance. By minimizing the number of vias, signal speed can significantly increase while reducing the likelihood of data errors.
6. Incorporate high-frequency decoupling capacitors at integrated circuit block power supply pins.
Attach a high-frequency decoupling capacitor adjacent to each power supply pin of the integrated circuit block. Augmenting the high-frequency decoupling capacitor at power supply pins effectively mitigates interference from high-frequency harmonics on these pins.
