Understanding and Resolving the Tombstone Phenomenon in PCB Assembly
Common Challenges in PCBA Processing
- Encountering the tombstone phenomenon during Surface Mount Technology (SMT)
Causes of Tombstone Phenomenon:
- Asynchronous melting times of solder paste
- Pad design elongation issues
- Excessive solder paste thickness
- Temperature curve settings
- Oxidized or contaminated welding ends
- Contamination of the pad surface
Mechanism of Formation:
- Heating during reflow soldering causing one end of the component to lift due to surface tension
Solution to Tombstone Phenomenon:
- Ensure proper pad design with reasonable extension size
- Stringently control the quality of incoming materials
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