Horizontal electroplating is an innovative method altering the traditional vertical plating setup. This electroplating approach involves placing printed circuit boards parallel to the plating liquid level. The cathode, in this case, is the PCB, and various systems use either conductive clips or conductive rollers for current supply. Notably, roller conduction is a more commonly employed method due to operational convenience.

Key Features of Horizontal Electroplating:

1. Conductive Rollers and Current Supply:
   • Cathode function performed by the PCB.
   • Conduction through rollers, facilitating current supply.
   • Rollers designed with spring devices for electroplating boards of varying thicknesses (0.10-5.00mm).
2. Cathode-Anode Switching for Maintenance:
   • Electroplating systems often switch the cathode to an anode during operation.
   • Auxiliary cathodes dissolve copper on plated rollers to prevent prolonged operation issues.
   • Design allows easy removal or replacement of wear-prone areas.
3. Anode Design and Plating Solution Flow:
   • Anodes constructed of insoluble titanium baskets filled with copper.
   • Plating solution circulation facilitated by a pump-nozzle system, ensuring uniform flow.
   • Vertical spraying of plating solution creates eddy currents for efficient coverage.
4. Filtration System for Clean Plating Solution:
   • A 1.2-micron filter system removes granular impurities, maintaining clean and pollution-free plating solution.
5. Considerations for Operation and Control:
   • Design considerations include ease of operation and automatic control of process parameters.
   • Computer control essential for adjusting parameters such as PCB size, hole diameter, copper thickness, transmission speed, and current density.

Conclusion: Horizontal electroplating systems, designed for ease of operation and precise control, are pivotal in achieving consistent, high-quality copper layers on printed circuit boards. The integration of advanced processes, including pre- and post-processing, forms a comprehensive system meeting the demands of new product development and launch.