1. The process of soldering the heating bridge in the SMT patch processing plant is not ideal. The soldering thermal bridge in SMT patch processing prevents the solder from forming a bridge. If this process is not executed correctly, it can result in cold solder joints or inadequate solder flow. Therefore, the correct soldering practice is to position the soldering iron tip between the pad and the pin, with the solder wire close to the soldering iron tip. As the solder melts, move the solder wire to the opposite side or place the solder wire between the pad and the pin. The soldering iron should be placed on the solder wire, and the wire should be moved to the opposite side once the solder has melted; this ensures a strong solder joint and prevents issues with chip processing.
2. Excessive force is applied during lead welding in SMT patch processing. Many SMT workers believe that applying too much force can enhance heat conduction and improve the soldering effect, leading them to press down forcefully during soldering. In reality, this is a poor practice that can lead to problems such as warping, delamination, depression, and white spots on the PCB of the patch.
1. Therefore, it is completely unnecessary to use excessive force during the soldering process. To ensure the quality of patch processing, gently touch the PCB soldering iron tip to the pad.
2. Randomly choosing the soldering iron tip, regardless of size, is a mistake. The size of the soldering iron tip is crucial. If the tip is too small, it prolongs the contact time, causing insufficient solder flow and cold solder joints. Conversely, a tip that is too large heats up too quickly, potentially burning the patch. The ideal tip size should be based on correct length and shape, appropriate heat capacity, and a contact surface slightly smaller than the pad.
3. Incorrect temperature settings can be problematic. If the temperature is too high, it may lift the pad, overheat the solder, and damage the circuit patch. Thus, setting the correct temperature is vital for quality assurance in patch processing.
4. Improper flux usage is another issue. Many workers use excessive flux, which can compromise solder joint reliability and lead to problems like corrosion and electron transfer issues.
5. Improper transfer soldering techniques can damage the soldering iron tip and result in poor wetting. The correct method involves placing the soldering iron tip between the pad and the pin, positioning the solder wire close to the tip, and moving the wire to the opposite side when the solder melts.
6. Unnecessary modification or rework during patch processing is a major pitfall. Pursuing perfection through excessive modification can break the metal layer of the patch, delaminate the PCB board, waste time, and even cause scrap. Avoid unnecessary modifications and rework.
2. Excessive force is applied during lead welding in SMT patch processing. Many SMT workers believe that applying too much force can enhance heat conduction and improve the soldering effect, leading them to press down forcefully during soldering. In reality, this is a poor practice that can lead to problems such as warping, delamination, depression, and white spots on the PCB of the patch.
1. Therefore, it is completely unnecessary to use excessive force during the soldering process. To ensure the quality of patch processing, gently touch the PCB soldering iron tip to the pad.
2. Randomly choosing the soldering iron tip, regardless of size, is a mistake. The size of the soldering iron tip is crucial. If the tip is too small, it prolongs the contact time, causing insufficient solder flow and cold solder joints. Conversely, a tip that is too large heats up too quickly, potentially burning the patch. The ideal tip size should be based on correct length and shape, appropriate heat capacity, and a contact surface slightly smaller than the pad.
3. Incorrect temperature settings can be problematic. If the temperature is too high, it may lift the pad, overheat the solder, and damage the circuit patch. Thus, setting the correct temperature is vital for quality assurance in patch processing.
4. Improper flux usage is another issue. Many workers use excessive flux, which can compromise solder joint reliability and lead to problems like corrosion and electron transfer issues.
5. Improper transfer soldering techniques can damage the soldering iron tip and result in poor wetting. The correct method involves placing the soldering iron tip between the pad and the pin, positioning the solder wire close to the tip, and moving the wire to the opposite side when the solder melts.
6. Unnecessary modification or rework during patch processing is a major pitfall. Pursuing perfection through excessive modification can break the metal layer of the patch, delaminate the PCB board, waste time, and even cause scrap. Avoid unnecessary modifications and rework.
