PCBA processing has specific appearance standards. The board’s appearance must be meticulously examined during acceptance, as even minor defects can lead to PCBA processing failures.
1. Poor solder joint contact angle: The wetting angle between the fillet weld and the pad’s end joint exceeds 90°.
2. Upright components: One end of the component either leaves the pad or stands upright or at an angle.
3. PCBA processing short circuit: Solder connects two or more solder joints that should remain separate, or it bridges adjacent wires.
4. Insufficient soldering: Component leads and PCB solder joints lack proper solder connection.
5. False soldering: Component leads and PCB solder joints appear connected but are not genuinely joined.
6. Cold soldering: Solder paste at the joints fails to melt completely or lacks proper metal alloy formation.
7. Insufficient tin: The area or height of tin between the component end and the pad does not meet specifications.
8. Excessive tin: The area or height of the tin consumption between the component end and the pad surpasses requirements.
9. Black solder joints: The solder joints appear black and lack luster.
10. Oxidation: The surfaces of components, circuits, pads, or solder joints exhibit chemical reactions, resulting in colored oxides.
11. Displacement: The component is misaligned from its intended position either horizontally, vertically, or rotationally on the pad.
12. Polarity reversal in PCBA processing: The orientation of a polarized component does not conform to the specified requirements and is reversed.
13. Floating height: There exists a gap or height difference between the components and the PCB.
14. Incorrect parts: The specifications, models, parameters, and shapes of components do not match those in the BOM, samples, or customer information.
15. Tin tip: The solder joints of the components are uneven, with a protruding tip.
16. Multiple components: According to the BOM, ECN, or sample board, multiple parts are either installed where they shouldn’t be or are redundant on the PCBA.
17. Missing components: Based on the BOM, ECN, or prototypes, parts that should be present on the PCB are completely absent.
18. Dislocation: The position of the component or pin has shifted to that of another pad or pin.
19. Open circuit: There is a disconnection in the PCB circuit.
20. Side placement: Chip components of varying width and height are incorrectly positioned on their sides.
21. Reverse orientation: Two symmetrical surfaces with different components are interchangeable, such as one with a silkscreen logo and one without being flipped, commonly seen in chip resistors.
22. Solder beads in PCBA processing: Small solder spots are present between component leads or outside the pads.
23. Air bubbles: Air bubbles are trapped within solder joints, components, or the PCB.
24. Excessive tinning: The height of the solder joints on the components exceeds the specified limits.
25. Tin crack: The solder joint exhibits cracks.
26. Plugged holes: The PCB’s through holes or vias are obstructed by solder or other materials.
27. Damage: There are cracks, cuts, or other damages to components, the board surface, copper foil, circuits, or vias.
28. Blurred silkscreen: The text or silkscreen on components or the PCB is fuzzy or illegible.
29. Dirtiness: The board surface is contaminated with foreign objects, stains, or other defects.
30. Scratches: The PCBA processing or buttons have scratches exposing copper foil.
31. Deformation: The components or PCB body are not aligned on the same plane and may be bent.
32. Blistering: Layers of copper and plating on PCBs or components show gaps.
33. Excessive glue: There is an overflow of adhesive beyond the required range.
34. Insufficient glue: The amount of adhesive is below the necessary range.
35. Pinhole: Pinhole concavities are present in the PCB, pads, or solder joints.
36. Burrs: The edges of the PCB or burrs exceed the specified limits or lengths.
37. Gold finger impurities in PCBA processing: The gold finger surface shows defects like pits, solder spots, or solder mask anomalies.
38. Gold finger scratches: There are visible scratches or exposed copper on the gold finger plating.
1. Poor solder joint contact angle: The wetting angle between the fillet weld and the pad’s end joint exceeds 90°.
2. Upright components: One end of the component either leaves the pad or stands upright or at an angle.
3. PCBA processing short circuit: Solder connects two or more solder joints that should remain separate, or it bridges adjacent wires.
4. Insufficient soldering: Component leads and PCB solder joints lack proper solder connection.
5. False soldering: Component leads and PCB solder joints appear connected but are not genuinely joined.
6. Cold soldering: Solder paste at the joints fails to melt completely or lacks proper metal alloy formation.
7. Insufficient tin: The area or height of tin between the component end and the pad does not meet specifications.
8. Excessive tin: The area or height of the tin consumption between the component end and the pad surpasses requirements.
9. Black solder joints: The solder joints appear black and lack luster.
10. Oxidation: The surfaces of components, circuits, pads, or solder joints exhibit chemical reactions, resulting in colored oxides.
11. Displacement: The component is misaligned from its intended position either horizontally, vertically, or rotationally on the pad.
12. Polarity reversal in PCBA processing: The orientation of a polarized component does not conform to the specified requirements and is reversed.
13. Floating height: There exists a gap or height difference between the components and the PCB.
14. Incorrect parts: The specifications, models, parameters, and shapes of components do not match those in the BOM, samples, or customer information.
15. Tin tip: The solder joints of the components are uneven, with a protruding tip.
16. Multiple components: According to the BOM, ECN, or sample board, multiple parts are either installed where they shouldn’t be or are redundant on the PCBA.
17. Missing components: Based on the BOM, ECN, or prototypes, parts that should be present on the PCB are completely absent.
18. Dislocation: The position of the component or pin has shifted to that of another pad or pin.
19. Open circuit: There is a disconnection in the PCB circuit.
20. Side placement: Chip components of varying width and height are incorrectly positioned on their sides.
21. Reverse orientation: Two symmetrical surfaces with different components are interchangeable, such as one with a silkscreen logo and one without being flipped, commonly seen in chip resistors.
22. Solder beads in PCBA processing: Small solder spots are present between component leads or outside the pads.
23. Air bubbles: Air bubbles are trapped within solder joints, components, or the PCB.
24. Excessive tinning: The height of the solder joints on the components exceeds the specified limits.
25. Tin crack: The solder joint exhibits cracks.
26. Plugged holes: The PCB’s through holes or vias are obstructed by solder or other materials.
27. Damage: There are cracks, cuts, or other damages to components, the board surface, copper foil, circuits, or vias.
28. Blurred silkscreen: The text or silkscreen on components or the PCB is fuzzy or illegible.
29. Dirtiness: The board surface is contaminated with foreign objects, stains, or other defects.
30. Scratches: The PCBA processing or buttons have scratches exposing copper foil.
31. Deformation: The components or PCB body are not aligned on the same plane and may be bent.
32. Blistering: Layers of copper and plating on PCBs or components show gaps.
33. Excessive glue: There is an overflow of adhesive beyond the required range.
34. Insufficient glue: The amount of adhesive is below the necessary range.
35. Pinhole: Pinhole concavities are present in the PCB, pads, or solder joints.
36. Burrs: The edges of the PCB or burrs exceed the specified limits or lengths.
37. Gold finger impurities in PCBA processing: The gold finger surface shows defects like pits, solder spots, or solder mask anomalies.
38. Gold finger scratches: There are visible scratches or exposed copper on the gold finger plating.
