Common Defects in PCBA Processing

• Poor solder joint contact angle: The angle between the fillet weld and the pad’s end joint exceeds 90°.
• Upright components: Components standing upright or at an angle, or not properly aligned with the pad.
• Short circuits: Solder connecting two or more joints that should remain separate.
• Insufficient soldering: Lack of proper solder connection between component leads and PCB joints.
• False soldering: Appearance of connected joints without genuine connection.
• Cold soldering: Incomplete melting of solder paste at joints.
• Insufficient or excessive tin: Tin amount between component end and pad not meeting specifications.
• Black solder joints: Solder joints appearing black and dull.

Additional Issues:

• Oxidation: Components, circuits, or pads showing colored oxides due to chemical reactions.
• Displacement: Misalignment of components horizontally, vertically, or rotationally.
• Polarity reversal: Incorrect orientation of polarized components.
• Floating height: Height difference between components and PCB.
• Incorrect parts: Mismatch in component specifications with BOM or customer information.

Explore more about PCBA processing and PCB fabrication for quality assurance.