1. Reasons for Copper Paving:
1. EMC: Large areas of ground or power supply copper serve a shielding function. Certain special grounds, such as PGND, play a protective role.
2. PCB Process Requirements: To ensure effective electroplating and prevent deformation during lamination, copper is laid on PCB layers with minimal wiring.
3. Signal Integrity: It’s essential to provide a complete return path for high-frequency digital signals while minimizing the DC network’s wiring. Additional factors include heat dissipation and specific device installation requirements necessitating copper.
2. Benefits of Copper Paving:
The primary advantage of copper paving is the reduction of ground wire impedance, which significantly contributes to anti-interference performance. Digital circuits often experience numerous spike currents, making it crucial to minimize ground wire impedance. Circuits entirely composed of digital devices should utilize large-area grounding. However, for analog circuits, the ground loop created by copper laying can lead to electromagnetic coupling interference that outweighs benefits (except in high-frequency scenarios). Therefore, not all circuits require standard copper (notably, mesh copper performance surpasses that of solid copper).
3. Significance of Copper Paving:
1. Laying copper and connecting it to the ground wire reduces the loop area.
2. A large copper area effectively decreases ground wire resistance and voltage drop. When working with high frequencies, digital and analog grounds should be separated, with copper laid and then linked at a single point. This single point can connect with a wire wrapped around a magnetic ring multiple times. However, if frequencies are moderate or the instrument conditions are acceptable, more flexibility is possible. The crystal oscillator acts as a high-frequency emission source in the circuit; spreading copper around it and grounding the oscillator’s casing will yield better results.
4. Difference Between Solid Copper and Grid Copper:
To analyze this in detail, there are approximately three key functions:
1. Aesthetic appeal;
2. Noise suppression;
3. Minimizing high-frequency interference on the PCB (source: ww.pcblx.com). According to routing standards, the power and ground layers should be as wide as possible. You might wonder why we need to introduce a grid—doesn’t that contradict this principle? From a high-frequency perspective, it’s even more critical to avoid sharp traces. If the power layer has angles greater than 90 degrees, it can lead to various issues. The reason for this approach largely stems from manufacturing requirements: for hand-soldered types, such patterns are rarely seen; if you encounter them, it’s likely due to a chip presence because of a particular assembly technique called wave soldering, which requires localized heating of the board. If the specific heat coefficients of both sides differ while the copper is uniformly distributed, the board may warp, leading to complications when the chip pin is in the upper steel cover (a process requirement). This can easily result in errors and a higher scrap rate.
However, this method has its drawbacks: under our current corrosion process, the film can adhere too readily. During later strong acid treatments, certain areas might remain uncorroded, leading to an accumulation of waste products. Ultimately, if the board fails, the chip will be compromised as well! From this perspective, do you understand the rationale behind this painting technique? Of course, some surface-mounted components are not gridded. Considering product consistency, there are two potential scenarios: a. The corrosion process is highly effective; b. Instead of wave soldering, a more advanced reflow soldering method is employed, though this option can raise the overall assembly line investment by three to five times.
If you have any PCB manufacturing needs, please do not hesitate to contact me.Contact me
1. EMC: Large areas of ground or power supply copper serve a shielding function. Certain special grounds, such as PGND, play a protective role.
2. PCB Process Requirements: To ensure effective electroplating and prevent deformation during lamination, copper is laid on PCB layers with minimal wiring.
3. Signal Integrity: It’s essential to provide a complete return path for high-frequency digital signals while minimizing the DC network’s wiring. Additional factors include heat dissipation and specific device installation requirements necessitating copper.
2. Benefits of Copper Paving:
The primary advantage of copper paving is the reduction of ground wire impedance, which significantly contributes to anti-interference performance. Digital circuits often experience numerous spike currents, making it crucial to minimize ground wire impedance. Circuits entirely composed of digital devices should utilize large-area grounding. However, for analog circuits, the ground loop created by copper laying can lead to electromagnetic coupling interference that outweighs benefits (except in high-frequency scenarios). Therefore, not all circuits require standard copper (notably, mesh copper performance surpasses that of solid copper).
3. Significance of Copper Paving:
1. Laying copper and connecting it to the ground wire reduces the loop area.
2. A large copper area effectively decreases ground wire resistance and voltage drop. When working with high frequencies, digital and analog grounds should be separated, with copper laid and then linked at a single point. This single point can connect with a wire wrapped around a magnetic ring multiple times. However, if frequencies are moderate or the instrument conditions are acceptable, more flexibility is possible. The crystal oscillator acts as a high-frequency emission source in the circuit; spreading copper around it and grounding the oscillator’s casing will yield better results.
4. Difference Between Solid Copper and Grid Copper:
To analyze this in detail, there are approximately three key functions:
1. Aesthetic appeal;
2. Noise suppression;
3. Minimizing high-frequency interference on the PCB (source: ww.pcblx.com). According to routing standards, the power and ground layers should be as wide as possible. You might wonder why we need to introduce a grid—doesn’t that contradict this principle? From a high-frequency perspective, it’s even more critical to avoid sharp traces. If the power layer has angles greater than 90 degrees, it can lead to various issues. The reason for this approach largely stems from manufacturing requirements: for hand-soldered types, such patterns are rarely seen; if you encounter them, it’s likely due to a chip presence because of a particular assembly technique called wave soldering, which requires localized heating of the board. If the specific heat coefficients of both sides differ while the copper is uniformly distributed, the board may warp, leading to complications when the chip pin is in the upper steel cover (a process requirement). This can easily result in errors and a higher scrap rate.
However, this method has its drawbacks: under our current corrosion process, the film can adhere too readily. During later strong acid treatments, certain areas might remain uncorroded, leading to an accumulation of waste products. Ultimately, if the board fails, the chip will be compromised as well! From this perspective, do you understand the rationale behind this painting technique? Of course, some surface-mounted components are not gridded. Considering product consistency, there are two potential scenarios: a. The corrosion process is highly effective; b. Instead of wave soldering, a more advanced reflow soldering method is employed, though this option can raise the overall assembly line investment by three to five times.
If you have any PCB manufacturing needs, please do not hesitate to contact me.Contact me
