With the rapid advancement of surface assembly technology and the increasing variety and quantity of chip components, integrated circuits (ICs) have become a vital part of electronic component production. In SMT chip processing, the inclusion of ICs poses a challenge, and IC sockets are utilized to address this issue. Below, I will introduce two forms of IC sockets utilized in SMT processing.
- Plug-in Socket: This socket is designed to convert surface mount ICs into jack mounts, offering a practical solution when a surface mount package is desired on a fully interposer board. It allows the use of existing assembly lines to assemble complete circuit boards rather than developing new assembly boards exclusively for mounting surface mount devices.
- Surface Mount Socket: This type of socket is specifically designed for surface mounting and possesses a land pattern similar to the original package. When properly designed, the board can directly mount the IC or an interchangeable socket. These sockets are commonly used in the early production of general-purpose ROM chips. It is important to note that there is no metallic bond between the socket and the component leads. Instead, mechanical contact is relied upon, which may lead to susceptibility to corrosion in high-humidity environments and vulnerability to mechanical contact breakage under shock or vibration. Additionally, the cost of sockets is considerably high, therefore, only components deemed logical are considered for socket use.
