1. In PCBA processing, many engineers strive to manage the amount of flux used; however, achieving optimal soldering performance sometimes necessitates a larger quantity of flux.

2. During the selective soldering phase of PCBA processing, engineers often focus primarily on the welding outcomes, overlooking concerns regarding flux residues.

3. Most flux systems employ glue-dispensing devices to mitigate stability risks. The flux selected for selective soldering should remain inert when in an inactive state—that is, when it is not being used.

4. Excessive application of flux by PCB manufacturers can lead to its infiltration into the SMD area, posing a potential risk of residues. Several critical parameters during the welding process can impact stability.

5. The main issue arises when the flux penetrates into the SMD or other areas where the temperature is low, leading to the formation of non-opening sections. While this may not adversely affect the welding process itself, during product usage, the interaction between the unactivated flux and humidity can lead to electromigration.

6. This interaction ultimately enhances the expansion properties of the flux, making it a crucial parameter to monitor.


A new development trend in the application of flux for selective soldering is to enhance the solid content, allowing for a higher solid PCBA content with a smaller flux application. Typically, the soldering process requires 500-2000 μg/in² of flux solid content. While the flux dosage can be managed by adjusting the soldering equipment parameters, the actual scenario can be quite complex. The expansion performance of the flux is crucial to its stability, as the total solid content after drying directly impacts welding quality.

However, every approach has its advantages and disadvantages. The benefits of the PCBA OEM method are clear, but there are inherent safety risks as well. Since PCBA foundry manufacturers oversee the procurement of electronic components and PCBs, there is a possibility that a PCB processing manufacturer might opt for counterfeit or substandard materials to cut costs. To mitigate this risk, clients can request the original material certification from the PCBA OEM manufacturer to ensure material quality.

Throughout the PCBA foundry material processing cycle, the procurement of electronic components is often the most volatile phase. For instance, customers might require components that are relatively rare, uncommon, or in high demand. Manufacturers lacking inventory who depend on orders may face delays in material arrival from chip factories, disrupting the normal production cycle. To prevent being in a disadvantaged position, product service providers can require PCBA OEM manufacturers to provide procurement timelines and track material delivery.

During the PCBA OEM production process, various factors can lead to significant quality issues, necessitating batch repairs. If the PCBA OEM chip processing manufacturer lacks robust repair capabilities, product maintenance can become challenging, prolonging the repair cycle and ultimately affecting product delivery times, which can result in considerable losses for customers.
If you have any PCB manufacturing needs, please do not hesitate to contact me.Contact me