**PCB Board Layout Rules**
1) Under normal circumstances, all components should be arranged on the same side of the circuit board. Only when the top side is too densely populated should devices with limited height and low heat generation, such as chip resistors, chip capacitors, and chip ICs, be placed on the bottom layer.
2) To ensure electrical performance, components should be placed on the grid and arranged parallel or perpendicular to each other to maintain neatness. Generally, components should not overlap; their arrangement should be compact, uniformly distributed, and consistent in density.
3) The spacing between adjacent pad patterns of different components should be greater than 1mm.
4) The distance from the edge of the circuit board should generally be no less than 2mm. The preferred shape of the circuit board is rectangular, with an aspect ratio of 3:2 or 4:3. For boards larger than 200mm by 150mm, mechanical strength should be considered.
**PCB Board Design Setup Skills**
PCB board design requires different settings at various stages. During the layout stage, use large grid points for device placement. For large devices such as ICs and non-positioning connectors, use 50-100 mil grid points. For smaller passive components like resistors, capacitors, and inductors, use 25 mil grid points. Larger grid points facilitate device alignment and improve layout aesthetics.
**PCB Board Design Layout Skills**
In PCB board layout design, analyze the circuit board’s unit and design according to its function. Follow these principles when arranging components:
1) Position each functional circuit unit according to the circuit flow to facilitate signal circulation and maintain consistent signal direction.
2) Arrange components around each functional unit, ensuring an even, integral, and compact layout on the PCB. Minimize and shorten leads and connections between components.
3) For high-frequency circuits, consider distribution parameters between components. Arrange components in parallel to enhance both aesthetics and ease of installation and mass production.
**Specific Wiring Design Considerations**
1) Keep trace lengths as short as possible to reduce lead inductance. In low-frequency circuits, avoid multipoint grounding, ensuring all ground currents flow through a common ground impedance or ground plane.
2) Place the common ground wire at the edge of the printed circuit board and maximize the copper foil reserved for grounding to enhance shielding.
3) Use a ground plane in double-layer boards to provide a low-impedance ground connection.
4) In multi-layer boards, design the ground layer as a mesh. Ensure the grid spacing of the ground wire is not too large to avoid creating large signal loops that can cause radiation and sensitivity issues. Small loop areas are more effective for signal return paths.
5) A ground plane helps reduce radiation loops on the PCB board.
1) Under normal circumstances, all components should be arranged on the same side of the circuit board. Only when the top side is too densely populated should devices with limited height and low heat generation, such as chip resistors, chip capacitors, and chip ICs, be placed on the bottom layer.
2) To ensure electrical performance, components should be placed on the grid and arranged parallel or perpendicular to each other to maintain neatness. Generally, components should not overlap; their arrangement should be compact, uniformly distributed, and consistent in density.
3) The spacing between adjacent pad patterns of different components should be greater than 1mm.
4) The distance from the edge of the circuit board should generally be no less than 2mm. The preferred shape of the circuit board is rectangular, with an aspect ratio of 3:2 or 4:3. For boards larger than 200mm by 150mm, mechanical strength should be considered.
**PCB Board Design Setup Skills**
PCB board design requires different settings at various stages. During the layout stage, use large grid points for device placement. For large devices such as ICs and non-positioning connectors, use 50-100 mil grid points. For smaller passive components like resistors, capacitors, and inductors, use 25 mil grid points. Larger grid points facilitate device alignment and improve layout aesthetics.
**PCB Board Design Layout Skills**
In PCB board layout design, analyze the circuit board’s unit and design according to its function. Follow these principles when arranging components:
1) Position each functional circuit unit according to the circuit flow to facilitate signal circulation and maintain consistent signal direction.
2) Arrange components around each functional unit, ensuring an even, integral, and compact layout on the PCB. Minimize and shorten leads and connections between components.
3) For high-frequency circuits, consider distribution parameters between components. Arrange components in parallel to enhance both aesthetics and ease of installation and mass production.
**Specific Wiring Design Considerations**
1) Keep trace lengths as short as possible to reduce lead inductance. In low-frequency circuits, avoid multipoint grounding, ensuring all ground currents flow through a common ground impedance or ground plane.
2) Place the common ground wire at the edge of the printed circuit board and maximize the copper foil reserved for grounding to enhance shielding.
3) Use a ground plane in double-layer boards to provide a low-impedance ground connection.
4) In multi-layer boards, design the ground layer as a mesh. Ensure the grid spacing of the ground wire is not too large to avoid creating large signal loops that can cause radiation and sensitivity issues. Small loop areas are more effective for signal return paths.
5) A ground plane helps reduce radiation loops on the PCB board.
