In the PCBA package production process, the use of SMD adhesive, solder paste, stencil, and other auxiliary materials is frequent. These materials play a crucial role in the entire assembly production process, influencing product quality and production efficiency significantly.
1. Shelf Life
Shelf life refers to the duration under specified conditions during which a material or product can meet the technical requirements and maintain appropriate performance.
2. Working Time
Working time denotes the maximum duration for which adhesive or solder paste can retain specified chemical and physical properties after exposure to the designated environment prior to use.
3. Viscosity
Refers to the adhesive’s dripping ductility and its ability to flow naturally.
4. Thixotropy Ratio
Chip adhesive and solder paste exhibit fluid-like characteristics under pressure but rapidly solidify into a plastic state after pressure is removed. This property is known as thixotropy.
5. Slump
Slump occurs after solder paste printing, caused by the combined effects of gravity, surface tension, and prolonged exposure to temperature or extended parking time, resulting in a reduction in height and a spreading of the bottom area beyond specified boundaries.
6. Spread
The distance that the adhesive covers at room temperature after dispensing.
7. Tack
Tack refers to the adhesion strength of the solder paste to components, which may change over time after paste printing.
8. Wetting
Describes the state of molten solder forming a uniform, smooth, and unbroken layer on the copper surface.
9. No-clean Solder Paste
A solder paste that leaves only a negligible amount of harmless solder residue after soldering, eliminating the need for PCB cleaning.
10. Low Temperature Paste
Solder paste with a melting temperature below 163℃.
WellCircuits Limited is an electronic processing enterprise specializing in SMT chip processing, DIP common processing, PCBA packaging, and PCB circuit board manufacturing. With years of experience in electronic processing, advanced production equipment, and a comprehensive after-sales service system, our SMT placement processing capacity reaches 1 million pieces per day, and DIP plug-in processing capacity is 200,000 pieces per day. We are dedicated to providing quality electronic processing services.
1. Shelf Life
Shelf life refers to the duration under specified conditions during which a material or product can meet the technical requirements and maintain appropriate performance.
2. Working Time
Working time denotes the maximum duration for which adhesive or solder paste can retain specified chemical and physical properties after exposure to the designated environment prior to use.
3. Viscosity
Refers to the adhesive’s dripping ductility and its ability to flow naturally.
4. Thixotropy Ratio
Chip adhesive and solder paste exhibit fluid-like characteristics under pressure but rapidly solidify into a plastic state after pressure is removed. This property is known as thixotropy.
5. Slump
Slump occurs after solder paste printing, caused by the combined effects of gravity, surface tension, and prolonged exposure to temperature or extended parking time, resulting in a reduction in height and a spreading of the bottom area beyond specified boundaries.
6. Spread
The distance that the adhesive covers at room temperature after dispensing.
7. Tack
Tack refers to the adhesion strength of the solder paste to components, which may change over time after paste printing.
8. Wetting
Describes the state of molten solder forming a uniform, smooth, and unbroken layer on the copper surface.
9. No-clean Solder Paste
A solder paste that leaves only a negligible amount of harmless solder residue after soldering, eliminating the need for PCB cleaning.
10. Low Temperature Paste
Solder paste with a melting temperature below 163℃.
WellCircuits Limited is an electronic processing enterprise specializing in SMT chip processing, DIP common processing, PCBA packaging, and PCB circuit board manufacturing. With years of experience in electronic processing, advanced production equipment, and a comprehensive after-sales service system, our SMT placement processing capacity reaches 1 million pieces per day, and DIP plug-in processing capacity is 200,000 pieces per day. We are dedicated to providing quality electronic processing services.
