Die Punching Method in PCB Processing

The die punching method is a common technique used in the blanking, hole, and shaping processing of printed circuit boards (PCBs). This method is particularly suitable for simple PCBs or those with low demands, making it ideal for low-level, high-volume PCB production with minimal profile needs, ultimately resulting in cost savings.

Punching Process

• Single-sided paper substrates and double-sided epoxy glass cloth substrates with non-metallized holes are typically punched using one or several molds for large production batches, various types, and numbers of holes, and complex shapes.

Shaping Processing

• For large batch single-sided and double-sided printed boards, shaping is usually achieved through stamping with dies, which can be divided into upper blanking dies and falling material dies based on the board size.

Composite Processing

• When precision requirements between holes and shapes are high, a composite mold is used to process holes and shapes simultaneously in a single panel, enhancing productivity and shortening the manufacturing cycle.

The key to successful PCB processing with molds lies in the design and processing of the molds, requiring professional technical knowledge. Many PCB manufacturing plants opt to outsource mold processing to external factories to ensure quality.

Precautions for Mold Installation

• Select the punch type and tonnage based on the calculated punching force, mold design, and closing height.
• Ensure all punch parts are functioning normally before operation.
• Use two shims ground simultaneously to guarantee parallel and perpendicular die installation.
• Prepare multiple sets of pressure plates and T-head pressure plate screws for proper mold installation without hindering the blanking process.
• Avoid screws and nuts on the lower mold from touching the upper mold during installation.

WellCircuits Limited specializes in producing high-precision double-sided, multilayer, and impedance-controlled circuit boards, offering a wide range of products to meet various customer needs, including blind buried vias, thick copper boards, HDI, backplanes, rigid-flex boards, buried capacitance, buried resistance, and Golden Finger PCBs.