Advantages of Hybrid Assembly Services in PCB Processing
In the realm of PCB processing, hybrid assembly services are gaining traction due to their integration of surface mount technology (SMT) and plated through-hole technology (PTH). These two technologies play pivotal roles in the OEM process. Beyond SMT and PTH, additional operations such as incorporating heat sinks, cables, and press-fit connectors are employed to bolster I/O communications. The amalgamation of these technologies brings forth a myriad of benefits.
Key Considerations for Mixed Assembly Placement
- Reduce the total number of components in the product:
- Implement a modular layout:
- Utilize multifunctional layout components:
- Opt for an easy-to-manufacture layout:
Streamlining the components decreases processing time, development time, equipment requirements, SMT processing complexity, service inspection, and testing.
Utilizing a modular layout enhances product versatility, simplifies redesign processes, and minimizes product alterations.
Components with self-alignment functions aid in effective module layout for mixed assembly placement.
Choosing the right layout and materials simplifies the PCB mixed assembly process, reducing issues related to tolerances and surface finish requirements.
