1. Determination of Board Shape, Size, and Number of Layers
▪ Any printed circuit board must integrate with other structural components. Therefore, the shape and size of the board should align with the product structure. From a production perspective, the design should be as simple as possible—typically a rectangle with a moderate aspect ratio—to facilitate assembly, enhance production efficiency, and lower labor costs.
▪ The number of layers should be based on the circuit performance requirements, board size, and circuit density. For multilayer boards, four-layer and six-layer configurations are the most common. For instance, a four-layer board includes two conductor layers (component side and solder side), a power layer, and a ground layer.
▪ The layers of a multilayer board should be symmetrical, ideally with an even number of copper layers such as four, six, or eight. Asymmetrical lamination can lead to warping, particularly in surface-mounted multilayer boards, which requires careful attention.
2. The Location and Orientation of the Components
▪ The location and orientation of components should first be considered in terms of circuit principles and align with the circuit’s direction. Proper placement directly affects the printed board’s performance, especially in high-frequency analog circuits, where device placement requirements are more stringent.
▪ Effective component placement often predicts the success of the printed board design. Therefore, when initiating the layout of the printed board and determining the overall design, a thorough analysis of the circuit principles is essential. First, identify the positions for special components (such as large ICs, high-power tubes, and signal sources), then arrange the remaining components while avoiding potential interference factors.
▪ Additionally, the overall structure of the printed board should be considered to prevent uneven and disordered component arrangement. This not only impacts the board’s aesthetics but also complicates assembly and maintenance.
How Electronic Hardware Engineers Design Multi-Layer PCB Boards
The Function of a PCB Board
In electronic equipment, a printed circuit board typically serves four functions:
(1) Provides necessary mechanical support for various circuit components.
(2) Facilitates electrical connections for circuits, achieving wiring or insulation between components such as integrated circuits.
(3) Delivers the electrical characteristics required by the circuit, such as characteristic impedance.
(4) Marks components on the board with symbols for easy insertion, inspection, and debugging.
Hardware Engineer’s Electronic Product Design Process:
The design process generally follows these steps:
Step 1: Identify the product functions required.
Step 2: Develop the design plan and list necessary components.
Step 3: Create the component symbol library based on the component list.
Step 4: Using the symbol library, draw the schematic diagram and simulate it with simulation software.
Step 5: Design the component package library according to the actual component shapes.
Step 6: Based on the schematic diagram, use the package library to create the PCB layout.
Step 7: Produce the PCB prototype.
Step 8: Perform circuit soldering, debugging, measurement, and testing. If the design does not meet requirements, repeat the above steps.
In this electronic product design process, PCB design is the ultimate link and core technology. After completing schematic drawing and circuit simulation, actual components are mounted on a printed circuit board (PCB). The schematic diagram addresses logical circuit connections, while the physical connections are realized through the PCB’s copper foil.
▪ Any printed circuit board must integrate with other structural components. Therefore, the shape and size of the board should align with the product structure. From a production perspective, the design should be as simple as possible—typically a rectangle with a moderate aspect ratio—to facilitate assembly, enhance production efficiency, and lower labor costs.
▪ The number of layers should be based on the circuit performance requirements, board size, and circuit density. For multilayer boards, four-layer and six-layer configurations are the most common. For instance, a four-layer board includes two conductor layers (component side and solder side), a power layer, and a ground layer.
▪ The layers of a multilayer board should be symmetrical, ideally with an even number of copper layers such as four, six, or eight. Asymmetrical lamination can lead to warping, particularly in surface-mounted multilayer boards, which requires careful attention.
2. The Location and Orientation of the Components
▪ The location and orientation of components should first be considered in terms of circuit principles and align with the circuit’s direction. Proper placement directly affects the printed board’s performance, especially in high-frequency analog circuits, where device placement requirements are more stringent.
▪ Effective component placement often predicts the success of the printed board design. Therefore, when initiating the layout of the printed board and determining the overall design, a thorough analysis of the circuit principles is essential. First, identify the positions for special components (such as large ICs, high-power tubes, and signal sources), then arrange the remaining components while avoiding potential interference factors.
▪ Additionally, the overall structure of the printed board should be considered to prevent uneven and disordered component arrangement. This not only impacts the board’s aesthetics but also complicates assembly and maintenance.
How Electronic Hardware Engineers Design Multi-Layer PCB Boards
The Function of a PCB Board
In electronic equipment, a printed circuit board typically serves four functions:
(1) Provides necessary mechanical support for various circuit components.
(2) Facilitates electrical connections for circuits, achieving wiring or insulation between components such as integrated circuits.
(3) Delivers the electrical characteristics required by the circuit, such as characteristic impedance.
(4) Marks components on the board with symbols for easy insertion, inspection, and debugging.
Hardware Engineer’s Electronic Product Design Process:
The design process generally follows these steps:
Step 1: Identify the product functions required.
Step 2: Develop the design plan and list necessary components.
Step 3: Create the component symbol library based on the component list.
Step 4: Using the symbol library, draw the schematic diagram and simulate it with simulation software.
Step 5: Design the component package library according to the actual component shapes.
Step 6: Based on the schematic diagram, use the package library to create the PCB layout.
Step 7: Produce the PCB prototype.
Step 8: Perform circuit soldering, debugging, measurement, and testing. If the design does not meet requirements, repeat the above steps.
In this electronic product design process, PCB design is the ultimate link and core technology. After completing schematic drawing and circuit simulation, actual components are mounted on a printed circuit board (PCB). The schematic diagram addresses logical circuit connections, while the physical connections are realized through the PCB’s copper foil.