Step 1: Identify the functions that the product needs to perform.
Step 2: Develop the design plan and list all required components.
Step 3: Create the component symbol library based on the component list.
Step 4: Using the component symbol library, design the schematic diagram according to the required functions, and simulate it with simulation software.
Step 5: Design the component package library based on the physical dimensions of the components.
Step 6: Using the component package library, draw the PCB layout according to the schematic diagram.
Step 7: Perform PCB prototyping.
Step 8: Solder, debug, test, etc. If the design does not meet the requirements, repeat the above steps.
PCB design is the most critical phase in the electronic product design process, and it is the core technology in electronics development. After completing the schematic and circuit simulation, the actual components need to be physically mounted onto the printed circuit board. The schematic drawing addresses the logical connections of the circuit, while the physical connections are made using copper traces on the PCB.
What is PCB?
A Printed Circuit Board (PCB) is a board made from an insulating substrate, processed to a specific size, with at least one conductive pattern and all necessary holes (such as component holes, mechanical mounting holes, and metallized holes) to facilitate electrical connections between components.
PCBs are designed for repeatability and predictability, allowing signals to be tested at any point along the circuit without causing short circuits. Most solder joints on a PCB can be completed in one soldering process.
Due to these characteristics, PCBs have been widely used and developed since their introduction. Modern PCBs have evolved to support multiple layers and finer lines. Notably, Surface Mount Device (SMD) technology, which gained prominence in the 1980s, has seamlessly integrated high-precision PCB technology with Very Large Scale Integrated Circuit (VLSI) technology, greatly enhancing system installation density and reliability.
**Second, Development of Printed Boards**
Although printed circuit technology rapidly advanced after World War II, the concept of “printed circuits” dates back to the 19th century.
During that time, mass production of PCBs did not involve complex electronic or electrical equipment, but rather focused on passive components like resistors and coils.
In 1899, Americans proposed a method of stamping metal foil onto a substrate to create resistors. By 1927, they introduced electroplating for making inductors and capacitors.
After years of development, Dr. Paul Eisler of the United Kingdom introduced the concept of the printed circuit board, establishing the foundation for photolithography.
With the rise of electronic devices, especially transistors, the number of electronic instruments surged, becoming more complex, and leading to a new phase in PCB development.
In the mid-1950s, the emergence of high-adhesion copper-clad laminates laid the material foundation for mass production of PCBs. By 1954, General Electric in the U.S. adopted pattern plating, using the etching method.
By the 1960s, printed boards had become a standard feature in electronic equipment, with screen printing, pattern plating, etching, and additive processes increasing line density. Today, there has been significant development in multi-layer PCBs, flexible circuits, metal-core PCBs, and functional PCBs.
The development of domestic PCB technology has been slower. In the mid-1950s, single-sided and double-sided boards were trial-produced. By the mid-1960s, metallized double-sided and multilayer PCBs were also tested. Around 1977, electroplating-corrosion and graphic electroplating processes were used to produce printed boards. In 1978, the aluminum foil-clad board was trial-produced using a semi-additive method. By the early 1980s, flexible and metal-core PCBs were developed.
**Third, PCB Principles**
PCBs serve four primary functions in electronic equipment:
1. Providing mechanical support for various components in the circuit.
2. Enabling electrical connections to facilitate circuit function and insulation between integrated circuits.
3. Ensuring the electrical characteristics of the circuit, such as characteristic impedance.
4. Marking component locations on the board for easier insertion, inspection, and debugging.
**Fourth, Types of Printed Boards**
Modern PCBs generally consist of an insulating board (substrate) coated with copper foil, often referred to as copper-clad laminates. PCBs can be categorized based on the conductive layers:
1. **Single-Sided Printed Board**
A single-sided printed board features conductive patterns on one side only. Typically, its thickness ranges from 0.2 to 5.0 mm. A printed circuit is formed on one side of an insulating substrate coated with copper foil. These boards are commonly used in electronic equipment with basic requirements, where wiring paths should not overlap, and individual traces must be bypassed.
2. **Double-Sided Printed PCB**
A double-sided printed board has conductive patterns on both sides, with a thickness range of 0.2 to 5.0 mm. Conductive circuits are etched on both sides of an insulating substrate, and the layers are electrically interconnected through metallized holes. These boards are suitable for higher-performance electronic equipment due to their higher wiring density, allowing for reduced equipment volume.
3. **Multilayer Printed Boards (Plint Bowde)**
Multilayer printed boards consist of multiple layers of conductive and insulating materials, laminated together. With more than two conductive layers, electrical interconnection between layers is achieved via metallized holes. Multilayer boards offer shorter, straighter connection paths, which aid in shielding, but they are more complex to produce and less reliable due to the metallized hole process. They are often used in computer cards.
As the number of layers increases, so does the complexity of production, failure rates, and costs. As a result, multilayer PCBs are reserved for advanced circuits.
Step 2: Develop the design plan and list all required components.
Step 3: Create the component symbol library based on the component list.
Step 4: Using the component symbol library, design the schematic diagram according to the required functions, and simulate it with simulation software.
Step 5: Design the component package library based on the physical dimensions of the components.
Step 6: Using the component package library, draw the PCB layout according to the schematic diagram.
Step 7: Perform PCB prototyping.
Step 8: Solder, debug, test, etc. If the design does not meet the requirements, repeat the above steps.
PCB design is the most critical phase in the electronic product design process, and it is the core technology in electronics development. After completing the schematic and circuit simulation, the actual components need to be physically mounted onto the printed circuit board. The schematic drawing addresses the logical connections of the circuit, while the physical connections are made using copper traces on the PCB.
What is PCB?
A Printed Circuit Board (PCB) is a board made from an insulating substrate, processed to a specific size, with at least one conductive pattern and all necessary holes (such as component holes, mechanical mounting holes, and metallized holes) to facilitate electrical connections between components.
PCBs are designed for repeatability and predictability, allowing signals to be tested at any point along the circuit without causing short circuits. Most solder joints on a PCB can be completed in one soldering process.
Due to these characteristics, PCBs have been widely used and developed since their introduction. Modern PCBs have evolved to support multiple layers and finer lines. Notably, Surface Mount Device (SMD) technology, which gained prominence in the 1980s, has seamlessly integrated high-precision PCB technology with Very Large Scale Integrated Circuit (VLSI) technology, greatly enhancing system installation density and reliability.
**Second, Development of Printed Boards**
Although printed circuit technology rapidly advanced after World War II, the concept of “printed circuits” dates back to the 19th century.
During that time, mass production of PCBs did not involve complex electronic or electrical equipment, but rather focused on passive components like resistors and coils.
In 1899, Americans proposed a method of stamping metal foil onto a substrate to create resistors. By 1927, they introduced electroplating for making inductors and capacitors.
After years of development, Dr. Paul Eisler of the United Kingdom introduced the concept of the printed circuit board, establishing the foundation for photolithography.
With the rise of electronic devices, especially transistors, the number of electronic instruments surged, becoming more complex, and leading to a new phase in PCB development.
In the mid-1950s, the emergence of high-adhesion copper-clad laminates laid the material foundation for mass production of PCBs. By 1954, General Electric in the U.S. adopted pattern plating, using the etching method.
By the 1960s, printed boards had become a standard feature in electronic equipment, with screen printing, pattern plating, etching, and additive processes increasing line density. Today, there has been significant development in multi-layer PCBs, flexible circuits, metal-core PCBs, and functional PCBs.
The development of domestic PCB technology has been slower. In the mid-1950s, single-sided and double-sided boards were trial-produced. By the mid-1960s, metallized double-sided and multilayer PCBs were also tested. Around 1977, electroplating-corrosion and graphic electroplating processes were used to produce printed boards. In 1978, the aluminum foil-clad board was trial-produced using a semi-additive method. By the early 1980s, flexible and metal-core PCBs were developed.
**Third, PCB Principles**
PCBs serve four primary functions in electronic equipment:
1. Providing mechanical support for various components in the circuit.
2. Enabling electrical connections to facilitate circuit function and insulation between integrated circuits.
3. Ensuring the electrical characteristics of the circuit, such as characteristic impedance.
4. Marking component locations on the board for easier insertion, inspection, and debugging.
**Fourth, Types of Printed Boards**
Modern PCBs generally consist of an insulating board (substrate) coated with copper foil, often referred to as copper-clad laminates. PCBs can be categorized based on the conductive layers:
1. **Single-Sided Printed Board**
A single-sided printed board features conductive patterns on one side only. Typically, its thickness ranges from 0.2 to 5.0 mm. A printed circuit is formed on one side of an insulating substrate coated with copper foil. These boards are commonly used in electronic equipment with basic requirements, where wiring paths should not overlap, and individual traces must be bypassed.
2. **Double-Sided Printed PCB**
A double-sided printed board has conductive patterns on both sides, with a thickness range of 0.2 to 5.0 mm. Conductive circuits are etched on both sides of an insulating substrate, and the layers are electrically interconnected through metallized holes. These boards are suitable for higher-performance electronic equipment due to their higher wiring density, allowing for reduced equipment volume.
3. **Multilayer Printed Boards (Plint Bowde)**
Multilayer printed boards consist of multiple layers of conductive and insulating materials, laminated together. With more than two conductive layers, electrical interconnection between layers is achieved via metallized holes. Multilayer boards offer shorter, straighter connection paths, which aid in shielding, but they are more complex to produce and less reliable due to the metallized hole process. They are often used in computer cards.
As the number of layers increases, so does the complexity of production, failure rates, and costs. As a result, multilayer PCBs are reserved for advanced circuits.
