Matters to Consider During Manual Soldering of PCBA:
1. Always use an electrostatic wrist strap, as the human body can generate static electricity exceeding 10,000 volts. Since ICs can be damaged at voltages above 300 volts, it’s essential to discharge any static through a grounding wire.
2. Use gloves or finger cots while handling components; bare hands should never touch the machine board or the gold contacts on the components.
3. Ensure proper soldering temperature, angle, and sequence to maintain the appropriate soldering time.
4. Handle the PCB correctly: when picking up the PCB, hold it by the edges and avoid touching any components on the board.
5. Utilize low-temperature soldering: High-temperature soldering accelerates the oxidation of the soldering iron tip, significantly reducing its lifespan. When the temperature of the soldering iron tip exceeds 470°C, its oxidation rate is twice that of 380°C.
6. Avoid applying excessive pressure while soldering: Excessive pressure can damage and deform the soldering iron tip. As long as the tip fully contacts the solder joints, adequate heat transfer occurs. (Select different soldering iron tips based on the size of the solder joints to enhance heat transfer efficiency.)
7. Refrain from knocking or shaking the soldering iron tip during soldering: Such actions can damage the heating core and cause tin beads to spatter, shortening the heating core’s lifespan. If tin beads land on the PCBA, they can create short circuits and lead to poor electrical performance.
8. Use a damp sponge to clean the soldering iron tip of oxide and excess tin dross: The sponge should be appropriately moistened; it shouldn’t completely remove solder swarf from the tip, as a rapid temperature drop (thermal shock) can harm the tip and its internal heating elements. Water on the tip can stick to the circuit board, potentially causing corrosion and short circuits. Insufficient wetness can lead to tip oxidation and poor soldering outcomes. Always ensure the sponge’s moisture content is adequate and clean it at least three times daily.
9. Ensure the right amount of solder and flux during soldering: Excess solder can lead to tin connections or bridging defects, while insufficient solder reduces mechanical strength and may lead to joint failures as the surface oxide layer thickens. Excessive flux can contaminate and corrode the PCBA, potentially causing electrical leakage, while too little flux can be ineffective.
10. Consistently keep the soldering iron tip tinned: This practice minimizes oxidation risk and prolongs the durability of the tip.
11. The occurrence of flux spatter and solder balls is linked to soldering technique proficiency and soldering iron tip temperature. Flux spatter can be mitigated by avoiding direct contact between the solder wire and the soldering iron when melting solder.
12. During manual PCBA soldering, take care not to burn the plastic insulation of nearby wires or the surfaces of components with the electric soldering iron, particularly in products with dense soldering structures and complex shapes.
1. Always use an electrostatic wrist strap, as the human body can generate static electricity exceeding 10,000 volts. Since ICs can be damaged at voltages above 300 volts, it’s essential to discharge any static through a grounding wire.
2. Use gloves or finger cots while handling components; bare hands should never touch the machine board or the gold contacts on the components.
3. Ensure proper soldering temperature, angle, and sequence to maintain the appropriate soldering time.
4. Handle the PCB correctly: when picking up the PCB, hold it by the edges and avoid touching any components on the board.
5. Utilize low-temperature soldering: High-temperature soldering accelerates the oxidation of the soldering iron tip, significantly reducing its lifespan. When the temperature of the soldering iron tip exceeds 470°C, its oxidation rate is twice that of 380°C.
6. Avoid applying excessive pressure while soldering: Excessive pressure can damage and deform the soldering iron tip. As long as the tip fully contacts the solder joints, adequate heat transfer occurs. (Select different soldering iron tips based on the size of the solder joints to enhance heat transfer efficiency.)
7. Refrain from knocking or shaking the soldering iron tip during soldering: Such actions can damage the heating core and cause tin beads to spatter, shortening the heating core’s lifespan. If tin beads land on the PCBA, they can create short circuits and lead to poor electrical performance.
8. Use a damp sponge to clean the soldering iron tip of oxide and excess tin dross: The sponge should be appropriately moistened; it shouldn’t completely remove solder swarf from the tip, as a rapid temperature drop (thermal shock) can harm the tip and its internal heating elements. Water on the tip can stick to the circuit board, potentially causing corrosion and short circuits. Insufficient wetness can lead to tip oxidation and poor soldering outcomes. Always ensure the sponge’s moisture content is adequate and clean it at least three times daily.
9. Ensure the right amount of solder and flux during soldering: Excess solder can lead to tin connections or bridging defects, while insufficient solder reduces mechanical strength and may lead to joint failures as the surface oxide layer thickens. Excessive flux can contaminate and corrode the PCBA, potentially causing electrical leakage, while too little flux can be ineffective.
10. Consistently keep the soldering iron tip tinned: This practice minimizes oxidation risk and prolongs the durability of the tip.
11. The occurrence of flux spatter and solder balls is linked to soldering technique proficiency and soldering iron tip temperature. Flux spatter can be mitigated by avoiding direct contact between the solder wire and the soldering iron when melting solder.
12. During manual PCBA soldering, take care not to burn the plastic insulation of nearby wires or the surfaces of components with the electric soldering iron, particularly in products with dense soldering structures and complex shapes.
