Prior to etching, it is essential to adhere to the first stage of processing. This involves determining the etching parameters (such as rate and temperature) through the initial processing of the board. Additionally, it is crucial to assess the pattern accuracy and line width of the processed board after etching. Once the first piece of etching has passed inspection, batch processing may commence.
The etching section should be equipped with inspection tools, such as a scale microscope, to enhance pre- and post-etching inspections. Utilizing a scale microscope allows for the examination of the microstrip line width on the board before and after etching. This proactive approach facilitates the timely identification of any issues and aids in elevating the overall quality of processing and inspection.
For patterns with denser wires, it is important to align them with the transmission direction of the etching machine. This helps to prevent the accumulation of etching solution on the PCB board surface. Furthermore, during etching, the denser side of the wires should face downwards, while the sparser side should face upwards. This setup enhances the uniformity of etching on both sides of the printed circuit pattern.
Throughout the etching process, continuous monitoring of the etching machine is essential. Regular checks should be conducted to verify the spraying status of the nozzles, ensuring that they are not blocked, and confirming the normal operation of the conveyor belt. This practice helps to mitigate the possibility of mechanical failures, scratch lines, and waste boards during the etching process.