The Latest Information on PCB Manufacturing Processes

1. The buried orifice plate, also known as the blind orifice plate, is similar to the common double plate, but with one side exposed.

2. In the positive film process, it is crucial to use a single-side D/F to prevent rolling the wrong side during exposure. Shielding the copper surface with black tape is essential to avoid light transmission.

3. Due to multiple manufacturing steps, blind hole plates often end up excessively thick. Careful attention is needed during drawing to control plate and copper thickness. After etching, specify the copper plate’s thickness range and use an X-Ray machine for precise hole punching in multilayer plates.

4. The negative film process is necessary for thin plates (< 12mil copper >) that cannot be produced through diagram electric drawing. Water Jin pull, although unable to fulfill specific requirements, often results in excessively thick single-side copper, leading to etching challenges and thin line issues.

5. Laser DRILL, a type of blind hole, has unique features:

• Aperture size: 4 — 6 mil
• PP thickness must be ≤ 4.5mil, calculated based on an aspect ratio of ≤ 0.75:1
• Three types of PP: LDPP 106 1080; FR4 106 1080; RCC

6. Prioritize resin sealing before lining in the board’s arranged processes to minimize potential line damage.