The production of PCBA circuit boards requires essential machinery, including a solder paste printer, placement machine, and reflow soldering unit, with the quality of this equipment directly affecting manufacturing capacity.
Essential electronic components required for the PCBA manufacturing process. Read More »
The ideal properties of upper backing plates for PCB drilling, emphasizing material composition, hardness, thermal conductivity, rigidity, and environmental considerations, with aluminum foil and composite materials highlighted for their advantages.
Techniques and Criteria for Selecting Drilling Pads in PCB Design Read More »
A typical PCB transmission line consists of conductive traces, usually copper, embedded in insulating material like FR4, with microstrip and stripline being the two main structures, each having distinct configurations and properties.
Transmission Line Structure and Principles in PCB Design Read More »
Essential precautions for selective wave soldering carrier and circuit board design, emphasizing issues like solder insufficiency, wall thickness, component height, and material properties to ensure effective soldering processes.
When is selective wave soldering utilized in PCB manufacturing? Read More »
The experiment aims to assess the impact of lead-free reflow on PCB circuit boards, specifically investigating delamination and copper hole wall failures due to the differing thermal expansion rates of board materials and copper during multiple reflow cycles.
Thermal cycling evaluation of lead-free reflow soldering on PCB assemblies. Read More »
Using modeling, specifically the zero-order model, to analyze the voltage-current characteristics and transient impedance of a PCB transmission line, where capacitors are arranged based on the capacitance per unit length.
PCB transmission line model for printed circuit boards. Read More »
PCB EMI design specifications, emphasizing the importance of decoupling capacitors for IC power pins and providing guidelines for routing clock lines based on frequency and length to minimize EMI.
Overview of Steps for PCB EMI Design Specifications Read More »
The causes of PCB deformation due to high temperatures, emphasizing the need for effective furnace tray materials to support increasingly thin electronic components during the SMT reflow process.
PCBA Assembly Process: Synthetic Stone Furnace Trays Read More »
The increased risks of “anode fiberglass yarn leakage” and dendrite formation in PCBs due to moisture and lead-free soldering, recommending the use of a lower moisture-absorbing hardener and emphasizing the importance of proper cleaning before applying green paint to prevent defects.
The Undisclosed Challenges of Lead-Free Soldering in PCB Fabrication Read More »
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Design and Wiring Guidelines for PCI Card PCB Circuit Boards Read More »
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