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Requirements for PCB Circuit Board Design in Chip-On-Board (COB) Applications

The essential PCB circuit board design requirements for Chip-on-Board (COB) technology, emphasizing the need for electroplated gold or ENIG surface treatment to ensure reliable connections.

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Fundamental Guidelines for Multilayer PCB Layout

Key principles for multilayer PCB layout, emphasizing the importance of trace spacing for electrical insulation and manufacturing constraints, particularly in the context of high-voltage and low-voltage circuits.

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Mitigate SSO through optimized PCB design.

Two key design methods for reducing SSO in PCBs with FPGAs, focusing on minimizing inductive coupling and PDN impedance through careful routing, layer allocation, and the strategic use of programmable ground/power pins.

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PCB quality assurance and SMT chip manufacturing technologies.

Various PCB quality inspection methods, including X-ray, scanning ultrasonic microscopy, and others, as well as issues like solder joint voids and their causes, ultimately highlighting the significance of proper inspection techniques for ensuring solder joint reliability and performance.

PCB quality assurance and SMT chip manufacturing technologies. Read More »

How do PCB manufacturers select lead-free solder?

the confusion and challenges PCB manufacturers face with lead-free solder due to unclear advantages among various brands and the need for reliable guidelines on selecting suitable materials for large-scale production.

How do PCB manufacturers select lead-free solder? Read More »

Considerations for Designing Circuit Boards with POWERPCB

Precautions for using PowerPCB software in PCB design, specifies design guidelines for better communication and mutual inspection among designers, notes that certain errors can be overlooked, and emphasizes the importance of re-plating copper after modifying traces and vias.

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Methodology for Balanced Stacking Design of PCB Circuit Boards

The designer considers creating an odd-numbered PCB, weighing the benefits of reducing layers for thickness and cost against cases where adding a layer may actually save money, while recognizing the differences between core and foil structures and their lamination processes.

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POWERPCB Circuit Board Design Guidelines

PCB design process using PADS’s PowerPCB software, emphasizing essential steps, design specifications, and communication within a design team to enhance workflow and minimize errors.

POWERPCB Circuit Board Design Guidelines Read More »

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