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There are various through-hole plating techniques used in PCB manufacturing.

The text outlines various PCB manufacturing processes, including hole wall activation for electroplating, through-hole plating, selective plating methods like reel-linkage and brush plating, and the use of low-viscosity ink for efficient prototyping, each aimed at improving adhesion, conductivity, and efficiency in the production of printed circuit boards.

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Efficient Signal Integrity Optimization in High-Speed PCB Design

In high-speed PCB design, traditional methods use hardware triggers and deep acquisition storage in oscilloscopes to pinpoint signal integrity issues, but emerging event recognition software offers faster, more versatile detection capabilities, promising significant improvements in efficiency for PCB design engineers.

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The IBIS model in PCB technology is used to analyze and address signal integrity issues.

This article explains how to use the IBIS model during PCB design to extract key variables for signal integrity analysis, emphasizing the importance of impedance matching to avoid signal reflections and transmission line issues, and guides the simulation of these parameters for effective PCB layout and design.

The IBIS model in PCB technology is used to analyze and address signal integrity issues. Read More »

What are the commonly used file formats for PCB design input and output?

The article outlines the key input and output file types used in PCB design, including schematic diagrams, structural element diagrams, engineering requirements, Gerber files, assembly files, stencil files, and PCB source files, essential for the design, testing, and manufacturing of printed circuit boards.

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Impedance Control Techniques for PCB Differential Routing

The text compares two PCB differential TDR test methods: the “True Differential Test Method,” which uses true differential signals to directly measure the characteristic impedance with virtual grounding, and the “Superposition” (Pseudo-differential) Method, which simulates differential impedance but requires separate grounding and cannot directly measure actual differential traces.

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