This article discusses the challenges and solutions in ensuring signal integrity and meeting timing requirements for DDR3 memory design in high-speed PCB systems, using Cadence’s time-domain analysis tool for simulation and offering design improvements to optimize system reliability.
PCB Simulation Design and Signal Integrity Analysis in PCB Systems Read More »
The advantages of PCB circuit board wet film include its excellent adhesion, resolution, and cost-effectiveness, along with faster production speeds, improved material utilization, and enhanced pattern accuracy for fine-line processing.
Highlight the benefits of using wet film in PCB circuit board manufacturing. Read More »
Poor soldering in PCB design and production can lead to various defects, often caused by issues like insufficient tinning, contamination, inadequate flux, or improper soldering temperature, and requires proper prevention strategies such as chemical analysis, pre-plating treatment, and temperature control.
Limited understanding of tin usage in PCB circuit boards. Read More »
Signal integrity issues, including waveform distortion, crosstalk, and track collapse, are becoming more prevalent in modern high-speed PCB designs due to faster IC switching speeds, lower core voltages, and increased noise sensitivity, with impedance matching playing a critical role in addressing these challenges.
Research on Signal Integrity in PCB (Printed Circuit Board) Read More »
PCB copy board (or reverse engineering) involves analyzing a physical circuit board to recreate its design files, schematic diagrams, and other technical documents, which are then used to replicate the original PCB.
The specifics of the PCB schematic reverse engineering process. Read More »
This article introduces PCB design guidelines for ensuring signal integrity (SI), emphasizing the importance of early SI issue identification, pre-design preparation, proper routing, and collaboration with manufacturers to optimize high-speed node performance, impedance control, and minimize crosstalk, all aimed at achieving efficient, high-quality PCB designs.
PCB Design Guidelines for Ensuring Signal Integrity Read More »
The text outlines various PCB manufacturing processes, including hole wall activation for electroplating, through-hole plating, selective plating methods like reel-linkage and brush plating, and the use of low-viscosity ink for efficient prototyping, each aimed at improving adhesion, conductivity, and efficiency in the production of printed circuit boards.
There are various through-hole plating techniques used in PCB manufacturing. Read More »
In high-speed PCB design, traditional methods use hardware triggers and deep acquisition storage in oscilloscopes to pinpoint signal integrity issues, but emerging event recognition software offers faster, more versatile detection capabilities, promising significant improvements in efficiency for PCB design engineers.
Efficient Signal Integrity Optimization in High-Speed PCB Design Read More »
PCB design software, such as the Altium Protel series, has evolved significantly over time, offering integrated tools for schematic design, PCB layout, and circuit simulation, with widespread adoption in China despite challenges like piracy and resource demands.
This article explains how to use the IBIS model during PCB design to extract key variables for signal integrity analysis, emphasizing the importance of impedance matching to avoid signal reflections and transmission line issues, and guides the simulation of these parameters for effective PCB layout and design.
The IBIS model in PCB technology is used to analyze and address signal integrity issues. Read More »
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