What are the potential risks associated with PCBA foundry materials? Confirming the authenticity of materials can be challenging, procurement cycles may fluctuate, maintenance can be complex, and there are various financial risks involved. Surface mount components in PCBA processing facilities possess characteristics such as lower parasitic capacitance and inductance, which enhance high-frequency performance and facilitate increased operating frequency and circuit speed. I will elaborate on this further.
1. What are the risks of PCBA foundry materials?
1. Confirming material authenticity is challenging
PCBA foundry manufacturers oversee the comprehensive production of electronic components and PCBs. Some processing facilities, focused on maximizing profit, might resort to sourcing counterfeit or substandard materials to cut production costs. To ensure material quality, it’s crucial to specify reliable suppliers and obtain original certificates for the materials.
2. The procurement cycle is unstable
Throughout the entire production cycle of PCBA processing, material procurement is the most unpredictable phase. This is particularly true when the components required by the customer are scarce or not widely available, or when there is high demand for certain components, leading to a situation where the foundry has no stock and must resort to ordering. At such times, uncontrollable factors may arise.
3. Difficulty in maintenance
If the PCBA foundry lacks robust repair capabilities, it can complicate product repairs and extend the repair cycle. This ultimately impacts product delivery times and may result in significant losses for customers.
4. Capital risk
The PCBA foundry production model necessitates that processing manufacturers assist customers in procuring all materials. Customers typically pay an advance of about 70% of the total cost, after which the manufacturer begins sourcing materials and executing the PCBA processing. The remaining 30% is due upon product shipment. Given the high value of PCBA OEM services, substantial transaction amounts can lead to financial strain if either party defaults on payments, increasing various uncontrollable risks.
PCBA processing plant
Second, characteristics of surface mount components in PCBA processing plants
1. On SMT component electrodes, some solder joints have no leads, while others feature very short leads. The spacing between adjacent electrodes is significantly less than the lead spacing of traditional dual in-line integrated circuits (2.54mm), with IC pin center distances shrinking from 1.27mm to 0.3mm. Consequently, for the same level of integration, SMT components occupy a much smaller area compared to traditional ones, with chip resistors and capacitors reduced from 3.2mm*1.6mm to 0.6mm*0.3mm. The advancement of bare chip technology has also led to the widespread adoption of high-pin-count devices like BGA and CSP in production.
2. SMT components are directly mounted on the surface of the printed circuit board, with their electrodes soldered to pads on the same side. This design eliminates pads around the PCB’s through holes, significantly enhancing the wiring density of the printed circuit board.
3. Surface mounting technology not only impacts the wiring area on the PCB but also affects the electrical characteristics of devices and components. The absence of leads or the use of short leads reduces parasitic capacitance and inductance, thereby enhancing high-frequency performance, which is beneficial for increasing circuit speed and frequency of operation.
4. The simple shape and sturdy structure of surface mount components allow them to closely adhere to the PCB surface, improving reliability and shock resistance. The absence of lead bending or wire trimming during assembly reduces the need for through holes in the printed circuit board. Standardized sizes and shapes facilitate the use of automatic placement machines, resulting in high efficiency, reliability, and convenience for mass production, ultimately lowering overall costs.
5. Traditionally, surface mount components either lack pins or feature short pins. Compared to through-hole components, the solderability testing methods and criteria differ. Surface mount components can withstand higher temperatures, but their pins or terminals can endure lower temperatures during soldering compared to DP pins.
1. What are the risks of PCBA foundry materials?
1. Confirming material authenticity is challenging
PCBA foundry manufacturers oversee the comprehensive production of electronic components and PCBs. Some processing facilities, focused on maximizing profit, might resort to sourcing counterfeit or substandard materials to cut production costs. To ensure material quality, it’s crucial to specify reliable suppliers and obtain original certificates for the materials.
2. The procurement cycle is unstable
Throughout the entire production cycle of PCBA processing, material procurement is the most unpredictable phase. This is particularly true when the components required by the customer are scarce or not widely available, or when there is high demand for certain components, leading to a situation where the foundry has no stock and must resort to ordering. At such times, uncontrollable factors may arise.
3. Difficulty in maintenance
If the PCBA foundry lacks robust repair capabilities, it can complicate product repairs and extend the repair cycle. This ultimately impacts product delivery times and may result in significant losses for customers.
4. Capital risk
The PCBA foundry production model necessitates that processing manufacturers assist customers in procuring all materials. Customers typically pay an advance of about 70% of the total cost, after which the manufacturer begins sourcing materials and executing the PCBA processing. The remaining 30% is due upon product shipment. Given the high value of PCBA OEM services, substantial transaction amounts can lead to financial strain if either party defaults on payments, increasing various uncontrollable risks.
PCBA processing plant
Second, characteristics of surface mount components in PCBA processing plants
1. On SMT component electrodes, some solder joints have no leads, while others feature very short leads. The spacing between adjacent electrodes is significantly less than the lead spacing of traditional dual in-line integrated circuits (2.54mm), with IC pin center distances shrinking from 1.27mm to 0.3mm. Consequently, for the same level of integration, SMT components occupy a much smaller area compared to traditional ones, with chip resistors and capacitors reduced from 3.2mm*1.6mm to 0.6mm*0.3mm. The advancement of bare chip technology has also led to the widespread adoption of high-pin-count devices like BGA and CSP in production.
2. SMT components are directly mounted on the surface of the printed circuit board, with their electrodes soldered to pads on the same side. This design eliminates pads around the PCB’s through holes, significantly enhancing the wiring density of the printed circuit board.
3. Surface mounting technology not only impacts the wiring area on the PCB but also affects the electrical characteristics of devices and components. The absence of leads or the use of short leads reduces parasitic capacitance and inductance, thereby enhancing high-frequency performance, which is beneficial for increasing circuit speed and frequency of operation.
4. The simple shape and sturdy structure of surface mount components allow them to closely adhere to the PCB surface, improving reliability and shock resistance. The absence of lead bending or wire trimming during assembly reduces the need for through holes in the printed circuit board. Standardized sizes and shapes facilitate the use of automatic placement machines, resulting in high efficiency, reliability, and convenience for mass production, ultimately lowering overall costs.
5. Traditionally, surface mount components either lack pins or feature short pins. Compared to through-hole components, the solderability testing methods and criteria differ. Surface mount components can withstand higher temperatures, but their pins or terminals can endure lower temperatures during soldering compared to DP pins.
