Several Common Integrated Circuit Packaging Forms
In the process of integrated circuit design and manufacturing, packaging is an indispensable part, and it is also the final stage of semiconductor integrated circuits. By encapsulating the core die of the device in a support, it can not only effectively prevent physical damage and chemical corrosion, but also provide external connection pins, so that the chip can be more conveniently mounted on the circuit board. What are the types of integrated circuit packaging?
1. SOP- Small Outline Package
SOP, also called SOL and DFP, is a very common form of components. It is also one of the surface mount packages, with pins led out from both sides of the package in an L shape. Packaging materials are divided into plastic and ceramic types. It originated in the late 1970s.
The SOP package has a wide range of applications, especially in memory LSIs. SOPs are popular in areas where input and output terminals are limited to 10-40. To meet production needs, variations like SOJ, SSOP, TSSOP, and SOIC have been derived.
2. PGA- Pin Grid Array Package
PGA chip packaging is commonly used for microprocessors. The IC is packaged in a ceramic chip with square pins on the bottom that can be inserted and soldered to the circuit board. This package is suitable for applications requiring frequent wave insertion and occupies less space than traditional dual in-line packages.
The PGA package is known for its plug-in convenience, high reliability, and compatibility with higher frequencies. Early generations of CPUs like the Pentium series and 80486 used this packaging.
3. BGA- Ball Grid Array Package
BGA is an improvement from PGA, featuring a grid pattern covering the pins on one surface. This package allows electronic signals to be transmitted to the printed circuit board with solder balls replacing pins on the bottom. BGA offers more pins than other packages and can improve high-speed performance due to shorter wire lengths.
WellCircuits Limited, a manufacturer specializing in high-precision double-sided, multilayer, impedance, blind buried vias, and thick copper circuit boards, provides products covering HDI, backplanes, rigid-flex combinations, buried capacitance and resistance, Golden Finger, and more.
4. DIP- Dual In-Line Package
DIP refers to an integrated circuit chip packaged in a dual in-line form. Most small to medium-sized ICs use this packaging form with up to 100 pins. The CPU chip with DIP packaging requires careful insertion and removal from the chip socket to avoid pin damage.
DIP packages are suitable for through-hole soldering on PCBs, offering ease of operation. The larger chip area to package area ratio results in larger volume. The Intel 8088 series of CPUs and early memory chips adopted DIP packaging.
In the process of integrated circuit design and manufacturing, packaging is an indispensable part, and it is also the final stage of semiconductor integrated circuits. By encapsulating the core die of the device in a support, it can not only effectively prevent physical damage and chemical corrosion, but also provide external connection pins, so that the chip can be more conveniently mounted on the circuit board. What are the types of integrated circuit packaging?
1. SOP- Small Outline Package
SOP, also called SOL and DFP, is a very common form of components. It is also one of the surface mount packages, with pins led out from both sides of the package in an L shape. Packaging materials are divided into plastic and ceramic types. It originated in the late 1970s.
The SOP package has a wide range of applications, especially in memory LSIs. SOPs are popular in areas where input and output terminals are limited to 10-40. To meet production needs, variations like SOJ, SSOP, TSSOP, and SOIC have been derived.
2. PGA- Pin Grid Array Package
PGA chip packaging is commonly used for microprocessors. The IC is packaged in a ceramic chip with square pins on the bottom that can be inserted and soldered to the circuit board. This package is suitable for applications requiring frequent wave insertion and occupies less space than traditional dual in-line packages.
The PGA package is known for its plug-in convenience, high reliability, and compatibility with higher frequencies. Early generations of CPUs like the Pentium series and 80486 used this packaging.
3. BGA- Ball Grid Array Package
BGA is an improvement from PGA, featuring a grid pattern covering the pins on one surface. This package allows electronic signals to be transmitted to the printed circuit board with solder balls replacing pins on the bottom. BGA offers more pins than other packages and can improve high-speed performance due to shorter wire lengths.
WellCircuits Limited, a manufacturer specializing in high-precision double-sided, multilayer, impedance, blind buried vias, and thick copper circuit boards, provides products covering HDI, backplanes, rigid-flex combinations, buried capacitance and resistance, Golden Finger, and more.
4. DIP- Dual In-Line Package
DIP refers to an integrated circuit chip packaged in a dual in-line form. Most small to medium-sized ICs use this packaging form with up to 100 pins. The CPU chip with DIP packaging requires careful insertion and removal from the chip socket to avoid pin damage.
DIP packages are suitable for through-hole soldering on PCBs, offering ease of operation. The larger chip area to package area ratio results in larger volume. The Intel 8088 series of CPUs and early memory chips adopted DIP packaging.
