In the PCB manufacturing process, issues with PCB film often arise when utilizing dry film technology. This article provides an overview of common faults and corresponding solutions for PCB film.
1. The dry film fails to adhere firmly to the copper foil.
– The copper foil surface may be contaminated with oil stains or oxide layers. To address this, thoroughly clean the board surface and wear gloves during operation.
– The solvent in the dry film may have evaporated or degraded. It is recommended to store the dry film at a low temperature and avoid using expired products.
– Adjust the PCB filming speed and temperature to prevent fast transfer speeds and low film temperatures.
– Maintain a relative humidity of 50% in the production environment to prevent issues related to low ambient humidity.
2. Air bubbles are present between the dry film and copper foil surface.
– Uneven surfaces on the copper foil, such as pits and scratches, can lead to air bubbles. Apply increased pressure during PCB filming and handle the board with care.
– Check for uneven surfaces on the hot pressing roller, as this can also cause air bubbles. Take care to protect the flat surface of the heat press roller.
– If the PCB film temperature is too high, adjust it accordingly to reduce the occurrence of air bubbles.
3. Wrinkles in the dry film.
– If the dry film is excessively sticky, handle the board carefully during placement.
– Avoid preheating the board to excessively high temperatures before applying the PCB film.
4. Excess adhesive on the board.
– Poor quality dry film should be replaced with a new batch.
– Reduce the exposure time during the development process to prevent excess glue.
– If the developer is ineffective, replace it with a fresh solution.
1. The dry film fails to adhere firmly to the copper foil.
– The copper foil surface may be contaminated with oil stains or oxide layers. To address this, thoroughly clean the board surface and wear gloves during operation.
– The solvent in the dry film may have evaporated or degraded. It is recommended to store the dry film at a low temperature and avoid using expired products.
– Adjust the PCB filming speed and temperature to prevent fast transfer speeds and low film temperatures.
– Maintain a relative humidity of 50% in the production environment to prevent issues related to low ambient humidity.
2. Air bubbles are present between the dry film and copper foil surface.
– Uneven surfaces on the copper foil, such as pits and scratches, can lead to air bubbles. Apply increased pressure during PCB filming and handle the board with care.
– Check for uneven surfaces on the hot pressing roller, as this can also cause air bubbles. Take care to protect the flat surface of the heat press roller.
– If the PCB film temperature is too high, adjust it accordingly to reduce the occurrence of air bubbles.
3. Wrinkles in the dry film.
– If the dry film is excessively sticky, handle the board carefully during placement.
– Avoid preheating the board to excessively high temperatures before applying the PCB film.
4. Excess adhesive on the board.
– Poor quality dry film should be replaced with a new batch.
– Reduce the exposure time during the development process to prevent excess glue.
– If the developer is ineffective, replace it with a fresh solution.
