In the production of PCB circuit boards, various options for surface treatment exist, including Immersion gold, Immersion silver, lead-free and lead-free spray tin, OSP, etc. Each option differs slightly in price and production process. Today, we will focus on OSP surface treatment.
1. OSP PCB Circuit Board Production Requirements
a.) Upon completion of PCB circuit board production, it is imperative to vacuum pack them with attached desiccants and humidity display cards. Additionally, avoid direct sunlight exposure and maintain an optimal storage environment with relative humidity between 30 to 70% and a temperature range of 15 to 30℃. The shelf life generally spans around 6 months.
b.) Throughout the production process, refrain from direct contact with the PCB circuit board surface to prevent oxidation. Thus, it is essential to wear gloves during operations.
c.) Damp OSP PCB circuit boards are unsuitable for baking and usage. High-temperature baking may lead to discoloration and OSP deterioration.
2. OSP PCB Circuit Board Printing Solder Paste Poor Board Processing Requirements
a.) Aim to minimize printing errors when applying solder paste, as the OSP protective layer can sustain damage during cleaning.
b.) In cases of inadequate solder paste application on the PCB circuit board, avoid soaking or cleaning with highly volatile solvents, as the OSP protective film is susceptible to corrosion by organic solvents. Instead, wipe off the solder paste using a non-woven cloth dipped in 75% alcohol, followed by timely blow-drying with an air gun. Avoid using isopropyl alcohol (IPA) for cleaning and refrain from using a stirring knife to scrape off poorly printed solder paste.
As a reputable FPC soft board manufacturer, WellCircuits Limited takes pride in collaborating with numerous clients. At WellCircuits Limited, we are committed to assisting our new customers in any way possible. Please feel free to reach out to us anytime for inquiries or assistance.
1. OSP PCB Circuit Board Production Requirements
a.) Upon completion of PCB circuit board production, it is imperative to vacuum pack them with attached desiccants and humidity display cards. Additionally, avoid direct sunlight exposure and maintain an optimal storage environment with relative humidity between 30 to 70% and a temperature range of 15 to 30℃. The shelf life generally spans around 6 months.
b.) Throughout the production process, refrain from direct contact with the PCB circuit board surface to prevent oxidation. Thus, it is essential to wear gloves during operations.
c.) Damp OSP PCB circuit boards are unsuitable for baking and usage. High-temperature baking may lead to discoloration and OSP deterioration.
2. OSP PCB Circuit Board Printing Solder Paste Poor Board Processing Requirements
a.) Aim to minimize printing errors when applying solder paste, as the OSP protective layer can sustain damage during cleaning.
b.) In cases of inadequate solder paste application on the PCB circuit board, avoid soaking or cleaning with highly volatile solvents, as the OSP protective film is susceptible to corrosion by organic solvents. Instead, wipe off the solder paste using a non-woven cloth dipped in 75% alcohol, followed by timely blow-drying with an air gun. Avoid using isopropyl alcohol (IPA) for cleaning and refrain from using a stirring knife to scrape off poorly printed solder paste.
As a reputable FPC soft board manufacturer, WellCircuits Limited takes pride in collaborating with numerous clients. At WellCircuits Limited, we are committed to assisting our new customers in any way possible. Please feel free to reach out to us anytime for inquiries or assistance.
