1. A circuit board, commonly referred to as a PCB, aluminum substrate, high-frequency board, thick copper board, impedance board, or ceramic board, serves as the electrical connection or insulation medium between various electronic components.
2. Optimization is crucial in this context; the primary substrate materials in use today include ceramic substrates, resin substrates, and metal or metal matrix composite materials.
3. Among these, ceramic substrates stand out due to their exceptional electrical insulation, stable chemical properties, and effective thermal conductivity.
4. Additionally, their mechanical strength, breakdown resistance, and high-temperature resilience make ceramic substrates the material of choice for high-power electronic circuits.
5. The common ceramic substrate materials available in the market primarily consist of beryllium oxide ceramics, alumina ceramics, and aluminum nitride ceramics.
1. Beryllium oxide (BeO) ceramic substrate: With a thermal conductivity reaching 250 W/(mK), this dielectric material possesses exceptional electrical, thermal, and mechanical properties. However, the presence of highly toxic powder poses severe health risks from long-term inhalation, leading to significant environmental concerns. This is why beryllium oxide ceramic substrates have not gained widespread adoption.
2. Aluminum nitride (AlN) ceramic substrate: As a high thermal conductivity ceramic, aluminum nitride is poised to partially replace beryllium oxide ceramics, featuring thermal conductivity of up to 200 W/(mK). It offers excellent thermal conductivity, mechanical strength, and resistance to high temperatures. Nevertheless, its production processes and raw materials result in higher costs compared to alumina ceramics, prompting many manufacturers to opt for the lower-performing alumina substrates.
3. Alumina (Al2O3) ceramic substrate: Alumina ceramics boast low dielectric loss, high mechanical strength, and good chemical stability. While its thermal conductivity is only 28 W/(m·K), the abundant raw materials and established processing technology make it a more cost-effective choice for manufacturers.
4. PCB iron substrates are widely utilized due to their favorable thermal conductivity, heat dissipation, electrical insulation, and mechanical processing characteristics. In circuit board production, PCB iron substrates typically comprise three layers: the circuit layer (copper foil), the insulating layer, and the metal base layer. These substrates find applications in LEDs, air conditioners, automobiles, ovens, electronics, and streetlights, particularly in high-power devices. Their thermal expansion, dimensional stability, and heat dissipation properties enable them to meet the demands of advanced products.
5. PCB iron substrate heat dissipation: Many double-sided and multi-layer boards today exhibit high density and power, complicating heat dissipation. Conventional printed circuit board substrates, such as FR4 and CEM3, are poor thermal conductors and cannot effectively dissipate heat due to interlayer insulation. This can lead to localized heating and potential high-temperature failures in electronic components, a problem that PCB iron substrates can effectively address. While copper substrates offer excellent heat dissipation, their cost remains prohibitively high.
6. PCB iron substrate dimensional stability: Aluminum-based printed boards show significantly better dimensional stability compared to insulating material-based boards. When subjected to temperatures ranging from 30°C to 140-150°C, aluminum-based printed boards and aluminum sandwich panels experience only a size change of 2.5-3.0%.
1. **Thermal Expansion of PCB Iron Substrate:** Thermal expansion and contraction are inherent properties of materials, with varying thermal expansion coefficients across different substances.
2. The aluminum-based printed circuit board effectively addresses heat dissipation issues, thus mitigating the thermal expansion and contraction of various components on the board, while enhancing the overall durability and reliability of machines and electronic devices.
3. This is particularly beneficial for tackling the thermal expansion and contraction challenges associated with SMT (Surface Mount Technology).
4. Additional advantages of PCB iron substrates include their shielding capability; serving as a replacement for brittle ceramic substrates; compatibility with surface mounting technology; reduction of the effective area of the printed board; and the ability to substitute radiators and other components, which boosts product heat resistance and physical properties.
5. Furthermore, these substrates help in lowering production costs and labor requirements.
2. Optimization is crucial in this context; the primary substrate materials in use today include ceramic substrates, resin substrates, and metal or metal matrix composite materials.
3. Among these, ceramic substrates stand out due to their exceptional electrical insulation, stable chemical properties, and effective thermal conductivity.
4. Additionally, their mechanical strength, breakdown resistance, and high-temperature resilience make ceramic substrates the material of choice for high-power electronic circuits.
5. The common ceramic substrate materials available in the market primarily consist of beryllium oxide ceramics, alumina ceramics, and aluminum nitride ceramics.
1. Beryllium oxide (BeO) ceramic substrate: With a thermal conductivity reaching 250 W/(mK), this dielectric material possesses exceptional electrical, thermal, and mechanical properties. However, the presence of highly toxic powder poses severe health risks from long-term inhalation, leading to significant environmental concerns. This is why beryllium oxide ceramic substrates have not gained widespread adoption.
2. Aluminum nitride (AlN) ceramic substrate: As a high thermal conductivity ceramic, aluminum nitride is poised to partially replace beryllium oxide ceramics, featuring thermal conductivity of up to 200 W/(mK). It offers excellent thermal conductivity, mechanical strength, and resistance to high temperatures. Nevertheless, its production processes and raw materials result in higher costs compared to alumina ceramics, prompting many manufacturers to opt for the lower-performing alumina substrates.
3. Alumina (Al2O3) ceramic substrate: Alumina ceramics boast low dielectric loss, high mechanical strength, and good chemical stability. While its thermal conductivity is only 28 W/(m·K), the abundant raw materials and established processing technology make it a more cost-effective choice for manufacturers.
4. PCB iron substrates are widely utilized due to their favorable thermal conductivity, heat dissipation, electrical insulation, and mechanical processing characteristics. In circuit board production, PCB iron substrates typically comprise three layers: the circuit layer (copper foil), the insulating layer, and the metal base layer. These substrates find applications in LEDs, air conditioners, automobiles, ovens, electronics, and streetlights, particularly in high-power devices. Their thermal expansion, dimensional stability, and heat dissipation properties enable them to meet the demands of advanced products.
5. PCB iron substrate heat dissipation: Many double-sided and multi-layer boards today exhibit high density and power, complicating heat dissipation. Conventional printed circuit board substrates, such as FR4 and CEM3, are poor thermal conductors and cannot effectively dissipate heat due to interlayer insulation. This can lead to localized heating and potential high-temperature failures in electronic components, a problem that PCB iron substrates can effectively address. While copper substrates offer excellent heat dissipation, their cost remains prohibitively high.
6. PCB iron substrate dimensional stability: Aluminum-based printed boards show significantly better dimensional stability compared to insulating material-based boards. When subjected to temperatures ranging from 30°C to 140-150°C, aluminum-based printed boards and aluminum sandwich panels experience only a size change of 2.5-3.0%.
1. **Thermal Expansion of PCB Iron Substrate:** Thermal expansion and contraction are inherent properties of materials, with varying thermal expansion coefficients across different substances.
2. The aluminum-based printed circuit board effectively addresses heat dissipation issues, thus mitigating the thermal expansion and contraction of various components on the board, while enhancing the overall durability and reliability of machines and electronic devices.
3. This is particularly beneficial for tackling the thermal expansion and contraction challenges associated with SMT (Surface Mount Technology).
4. Additional advantages of PCB iron substrates include their shielding capability; serving as a replacement for brittle ceramic substrates; compatibility with surface mounting technology; reduction of the effective area of the printed board; and the ability to substitute radiators and other components, which boosts product heat resistance and physical properties.
5. Furthermore, these substrates help in lowering production costs and labor requirements.
