While not an absolute rule, SMT components typically undergo reflow soldering, whereas through-hole components are subjected to wave soldering.
In through-hole PCB assembly, manual insertion is common, and wave soldering creates robust solder joints even after component insertion into drilled holes.
SMT Component Processing:
SMT components involve applying solder paste directly to pads, maintaining component leads in position.
Hybrid applications may require both wave and reflow soldering simultaneously.
Benefits of SMT Processing:
Size Advantage:
SMT components are inherently small, contributing to a clean and attractive appearance.
No drilling is needed, aligning with the trend of smaller electronic product boards.
Availability:
SMT has largely replaced through-hole components, especially in PCB patches for resistors and capacitors.
Performance:
Smaller SMT components reduce signal transmission distances, minimizing signal flight time.
Cost-Effectiveness:
SMT parts are generally more cost-effective compared to through-hole parts.
Benefits of Through-Hole Processing:
Availability:
Larger through-hole parts are readily available, suitable for high-power applications.
Strength:
Components like connectors, switches, and interface components benefit from the strength provided by leads soldered into drilled holes.
Power Considerations:
Through-hole technology is preferable for high-power circuits, ensuring firm solder joints and mechanical strength for thermal stability, high voltage, and mechanical stability.
Conclusion:
The choice between SMT and through-hole methods depends on specific application requirements, with each offering distinct advantages in terms of size, availability, performance, cost-effectiveness, strength, and power considerations.