Technical Advancements in HDI Multilayer Boards

Understanding the technical development characteristics of HDI multilayer boards is crucial for studying the performance requirements of its substrate materials in technology advancement. The innovative nature of HDI multilayer board development, diverse process methods, practicality, and close relationship with material technology progress are distinctive features. Its reliance on materials is notable, as advancements in HDI are closely associated with substrate materials.

Impact on High-Performance Copper Clad Laminate (CCL) Technology

The development of HDI multilayer boards has significantly influenced the advancement of high-performance copper clad laminates. Factors include the diversification of substrate material products, specializations by manufacturers, and the pursuit of balanced CCL performance. The rapid development of HDI multilayer boards has triggered diversification, multiple varieties, specialization, and rapid product development in the CCL industry.

Strategies for the Epoxy Resin Industry

To address the development of high-performance copper clad laminates, the epoxy resin industry can consider developing serialized products to suit the variety of CCL. Moreover, it should transition from coordination to integration with the CCL industry, explore epoxy resin composition suitable for CCL, and develop characteristic brand products to assist downstream manufacturers. This collaboration will result in resin supply chains being more closely aligned with CCL manufacturers.

Key Development Challenges

As HDI multilayer board technology progresses, the substrate material manufacturing industry faces challenges related to narrower conductive circuits, finer via holes, and thinner insulating layers. Addressing the reliability of substrate insulation, reliable through-holes, and achieving thinner profiles for high-performance CCL will be critical.

Future of HDI Multilayer Board Technology

The upcoming focus in HDI multilayer board technology will be on finer conductive circuits and via holes, along with thinner substrate insulating layers. Consequently, ensuring substrate insulation reliability and reliable through-holes, as well as achieving thinner profiles for high-performance CCL, will be essential goals for the substrate material manufacturing industry.