1. Copper foil over-etching is a common issue in PCB fabrication. Below are the reasons for this problem:
2. The copper foil may be over-etched due to changes in specifications without adjusting etching parameters. This can lead to excessive corrosion and separation of the thin circuit backing zinc layer from the substrate, causing the copper wire to fall off. Poor drying after etching can also result in the generation of excessive undercutting and dumping of copper.
3. Another reason for copper fall off is a local collision during the PCB circuit board process, causing the copper wire to be separated from the base material by external mechanical force.
4. Unreasonable circuit design with thick copper foil that is too thin can also lead to excessive etching of the circuit and copper rejection.
2. The copper foil may be over-etched due to changes in specifications without adjusting etching parameters. This can lead to excessive corrosion and separation of the thin circuit backing zinc layer from the substrate, causing the copper wire to fall off. Poor drying after etching can also result in the generation of excessive undercutting and dumping of copper.
3. Another reason for copper fall off is a local collision during the PCB circuit board process, causing the copper wire to be separated from the base material by external mechanical force.
4. Unreasonable circuit design with thick copper foil that is too thin can also lead to excessive etching of the circuit and copper rejection.
