1. We understand from the PCBA processing process that electroplating plays a critical role in PCB production. It helps to prevent PCBs from being exposed to air for extended periods, thus reducing the risk of oxidation and deterioration of weldability.
2. The principle behind PCB electroplating is worth exploring. Let’s delve into it today.
1. The PCB electroplating principle encompasses four key aspects: the PCB electroplating solution, the PCB electroplating reaction, the electrode and reaction principle, and the metal electrodeposition process.
2. In the PCB electroplating solution, there are six essential elements: main salt, complexing agent, additional salt, buffer, anode activator, and additive.
3. The electrochemical reaction in the PCB electroplating process occurs with the plated parts serving as the cathode, connected to the negative pole of the DC power supply. The metal anode is connected to the positive pole of the DC power supply, and both the anode and cathode are immersed in the plating solution.
4. A certain potential applied between the cathode and the anode leads to a reaction at the cathode where metal ion Mn+ diffuses from the plating solution to the electrode-plating solution interface, receives n electrons from the cathode, and is then reduced to metal M.
5. The reaction at the anode is the opposite of that at the cathode, resulting in the dissolution of metal M at the anode interface and the release of n electrons to generate metal ion Mn+.
6. Electroplating is vital in the PCB industry because copper, which is used to interconnect components on a substrate, can lose its luster due to oxidation and weldability due to corrosion when exposed to air for an extended period.
7. Various technologies, such as organic coatings, oxide films, and electroplating, are used to protect copper printing lines, through-holes, and electroplating through-holes.
8. The use of organic coatings is straightforward, but changes in its concentration, composition, and curing cycle can lead to unpredictable weldability deviations.
9. Oxide films can protect circuits from corrosion but cannot maintain solderability, which is where plating or metal coating processes come into play.
10. Plating a layer of solderable metal on the printed circuit board has become a standard operation to provide a solderable protective layer for copper printed circuits.
11. In electronic equipment, the interconnection of various modules often requires the use of printed circuit board plug sockets with spring contacts and connection contacts with a layer of rare metals, such as gold, for high wear resistance and low contact resistance.
12. Alternative coated metals for printed circuits can include tin plating and copper plating, depending on the specific requirements.
13. Another coating on the copper plate printing line is an organic solder film applied by screen printing technology when welding is not required.
14. The rigorous requirements and quality control standards in the PCB industry have propelled PCB board electroplating practices towards the future in line with the increasing dependence on precise technology and environmental and safety adaptability.
2. The principle behind PCB electroplating is worth exploring. Let’s delve into it today.
1. The PCB electroplating principle encompasses four key aspects: the PCB electroplating solution, the PCB electroplating reaction, the electrode and reaction principle, and the metal electrodeposition process.
2. In the PCB electroplating solution, there are six essential elements: main salt, complexing agent, additional salt, buffer, anode activator, and additive.
3. The electrochemical reaction in the PCB electroplating process occurs with the plated parts serving as the cathode, connected to the negative pole of the DC power supply. The metal anode is connected to the positive pole of the DC power supply, and both the anode and cathode are immersed in the plating solution.
4. A certain potential applied between the cathode and the anode leads to a reaction at the cathode where metal ion Mn+ diffuses from the plating solution to the electrode-plating solution interface, receives n electrons from the cathode, and is then reduced to metal M.
5. The reaction at the anode is the opposite of that at the cathode, resulting in the dissolution of metal M at the anode interface and the release of n electrons to generate metal ion Mn+.
6. Electroplating is vital in the PCB industry because copper, which is used to interconnect components on a substrate, can lose its luster due to oxidation and weldability due to corrosion when exposed to air for an extended period.
7. Various technologies, such as organic coatings, oxide films, and electroplating, are used to protect copper printing lines, through-holes, and electroplating through-holes.
8. The use of organic coatings is straightforward, but changes in its concentration, composition, and curing cycle can lead to unpredictable weldability deviations.
9. Oxide films can protect circuits from corrosion but cannot maintain solderability, which is where plating or metal coating processes come into play.
10. Plating a layer of solderable metal on the printed circuit board has become a standard operation to provide a solderable protective layer for copper printed circuits.
11. In electronic equipment, the interconnection of various modules often requires the use of printed circuit board plug sockets with spring contacts and connection contacts with a layer of rare metals, such as gold, for high wear resistance and low contact resistance.
12. Alternative coated metals for printed circuits can include tin plating and copper plating, depending on the specific requirements.
13. Another coating on the copper plate printing line is an organic solder film applied by screen printing technology when welding is not required.
14. The rigorous requirements and quality control standards in the PCB industry have propelled PCB board electroplating practices towards the future in line with the increasing dependence on precise technology and environmental and safety adaptability.
