1. TOP LAYER (top wiring layer):
This layer features the top copper foil traces. If the PCB is a single-layer board, this layer is absent.
2. BOTTOM LAYER (bottom wiring layer):
This layer includes the bottom copper foil traces.
3. TOP/BOTTOM SOLDER (top/bottom solder mask layer):
A solder mask layer is applied to the top and bottom to prevent solder from bridging onto the copper traces and to ensure insulation. Windows are opened in the solder mask for pads, vias, and non-electrical traces. By default, the pad will be exposed with a 0.1016mm extension, which is tinned during wave soldering. It is advisable to avoid design changes to maintain proper solderability.
Sure, I’ll adjust the text for clarity and consistency, while maintaining the original line numbers:
1. The via hole will be opened by default in the design (OVERRIDE: 0.1016mm), which means the via hole exposes the copper foil, expands by 0.1016mm, and will be tinned during wave soldering. If the design requires avoiding tin on the vias and not exposing the copper, you must check the PENTING option in the additional properties of the vias SOLDER MASK (solder mask opening), and then close the via opening.
2. Additionally, this layer can also independently handle non-electrical wiring, and the solder mask green oil will open the window accordingly. If it is on a copper foil trace, it is used to enhance the overcurrent capability of the trace, and tin is added during soldering. If it is on a non-copper foil trace, it is generally designed for logo identification and special character silk screen printing, which can omit the character silk screen layer.
3. TOP/BOTTOM PASTE (top/bottom solder paste layer):
This layer is generally used to apply solder paste during the SMT reflow process of SMT components and is unrelated to the printed board manufacturer’s board. It can be deleted when exporting GERBER files, and the PCB design can ensure the default settings.
4. TOP/BOTTOM OVERLAY (top/bottom screen printing layer):
Designed for various silk-screened logos, such as component numbers, characters, trademarks, etc.
5. MECHANICAL LAYERS (mechanical layer):
Designed to represent the PCB mechanical shape, with the default LAYER1 being the shape layer. Other layers like LAYER2/3/4 can be used for mechanical size marking or special purposes. For example, when some boards need to be coated with conductive carbon ink, LAYER2/3/4 can be used, but the purpose of each layer must be clearly indicated on the same layer.
6. KEEPOUT LAYER (prohibited wiring layer):
This designates areas where wiring is prohibited, and many designers also use it to define the mechanical shape of the PCB. If both KEEPOUT and MECHANICAL LAYER1 are present on the PCB, it mainly depends on the completeness of the appearance of the two layers, usually based on MECHANICAL LAYER1. It is recommended to use MECHANICAL LAYER1 as the shape layer when designing. If KEEPOUT LAYER is chosen as the shape, MECHANICAL LAYER1 should not be used.
7. MIDLAYERS (middle signal layer):
Primarily used for multi-layer boards and can also serve as a special layer, but you must understand the role of the layer in the context of the overall design.
8. INTERNAL PLANES (internal electrical layer):
Suitable for multi-layer boards.
9. MULTI LAYER (through hole layer):
Represents the via pad layer.
10. DRILL GUIDE (drilling positioning layer):
The coordinate layer used to position the center of the hole for the pad and via hole.
11. DRILL DRAWING (drilling description layer):
Provides the description layer of the hole diameter for PCB pads and vias.
This layer features the top copper foil traces. If the PCB is a single-layer board, this layer is absent.
2. BOTTOM LAYER (bottom wiring layer):
This layer includes the bottom copper foil traces.
3. TOP/BOTTOM SOLDER (top/bottom solder mask layer):
A solder mask layer is applied to the top and bottom to prevent solder from bridging onto the copper traces and to ensure insulation. Windows are opened in the solder mask for pads, vias, and non-electrical traces. By default, the pad will be exposed with a 0.1016mm extension, which is tinned during wave soldering. It is advisable to avoid design changes to maintain proper solderability.
Sure, I’ll adjust the text for clarity and consistency, while maintaining the original line numbers:
1. The via hole will be opened by default in the design (OVERRIDE: 0.1016mm), which means the via hole exposes the copper foil, expands by 0.1016mm, and will be tinned during wave soldering. If the design requires avoiding tin on the vias and not exposing the copper, you must check the PENTING option in the additional properties of the vias SOLDER MASK (solder mask opening), and then close the via opening.
2. Additionally, this layer can also independently handle non-electrical wiring, and the solder mask green oil will open the window accordingly. If it is on a copper foil trace, it is used to enhance the overcurrent capability of the trace, and tin is added during soldering. If it is on a non-copper foil trace, it is generally designed for logo identification and special character silk screen printing, which can omit the character silk screen layer.
3. TOP/BOTTOM PASTE (top/bottom solder paste layer):
This layer is generally used to apply solder paste during the SMT reflow process of SMT components and is unrelated to the printed board manufacturer’s board. It can be deleted when exporting GERBER files, and the PCB design can ensure the default settings.
4. TOP/BOTTOM OVERLAY (top/bottom screen printing layer):
Designed for various silk-screened logos, such as component numbers, characters, trademarks, etc.
5. MECHANICAL LAYERS (mechanical layer):
Designed to represent the PCB mechanical shape, with the default LAYER1 being the shape layer. Other layers like LAYER2/3/4 can be used for mechanical size marking or special purposes. For example, when some boards need to be coated with conductive carbon ink, LAYER2/3/4 can be used, but the purpose of each layer must be clearly indicated on the same layer.
6. KEEPOUT LAYER (prohibited wiring layer):
This designates areas where wiring is prohibited, and many designers also use it to define the mechanical shape of the PCB. If both KEEPOUT and MECHANICAL LAYER1 are present on the PCB, it mainly depends on the completeness of the appearance of the two layers, usually based on MECHANICAL LAYER1. It is recommended to use MECHANICAL LAYER1 as the shape layer when designing. If KEEPOUT LAYER is chosen as the shape, MECHANICAL LAYER1 should not be used.
7. MIDLAYERS (middle signal layer):
Primarily used for multi-layer boards and can also serve as a special layer, but you must understand the role of the layer in the context of the overall design.
8. INTERNAL PLANES (internal electrical layer):
Suitable for multi-layer boards.
9. MULTI LAYER (through hole layer):
Represents the via pad layer.
10. DRILL GUIDE (drilling positioning layer):
The coordinate layer used to position the center of the hole for the pad and via hole.
11. DRILL DRAWING (drilling description layer):
Provides the description layer of the hole diameter for PCB pads and vias.
