1. There should be a more distinct PCB layout separating AC input from DC output, ideally allowing for complete isolation between the two.
2. The distance between the input and output terminals (including both primary and secondary DC/DC conversion) should be no less than 5 mm.
3. The layout for the control circuit and the main power circuit needs to be clearly differentiated.
4. Avoid running high current and high voltage wires in parallel with measurement and control lines.
5. Maximize the use of copper on any blank areas of the PCB.
6. For connections involving high current and high voltage, minimize the use of long-distance wire connections, as they can introduce challenging interference issues.
7. If budget permits, consider using multi-layer boards with dedicated auxiliary power and ground layers, which can significantly mitigate EMC effects.
8. The work area is particularly prone to interference, so utilize large areas of copper for wiring wherever possible.
9. In PCB design and layout, ensure that the shielding ground wiring does not form noticeable loops, as this can create an antenna effect that invites interference.
10. High-power devices should be arranged in a more organized layout to enhance the installation of the heat sink and the design of the cooling airflow path.
1. Ground Wire Design
1. Appropriately select the combination of single-point and multi-point grounding.
2. Isolate the digital circuit from the analog circuit.
3. Use the thickest ground wire feasible.
4. Form the ground wire into a closed loop.
2. Electromagnetic Compatibility Design
1. Choose an appropriate wire width.
2. Implement the correct wiring strategy.
Utilizing equal routing can help minimize wire inductance, but it may increase mutual inductance and distributed capacitance between wires. If layout permits, a grid-pattern wiring structure is preferable. Specifically, wire one side of the printed board horizontally and the other side vertically, connecting them through metallized holes at the intersections.
To mitigate crosstalk between conductors on the printed circuit board, avoid long-distance equal routing when designing the layout. Maximize spacing between wires, and minimize the crossing of signal wires over ground and power wires. Inserting a grounded trace between sensitive signal lines can effectively reduce crosstalk.
3. Decoupling Capacitor Configuration
In DC power supply circuits, load variations can introduce power supply noise. For instance, in digital circuits, transitions between states can generate large spike currents on the power line, resulting in transient noise voltage. The strategic placement of decoupling capacitors helps suppress noise from load changes, a common practice in the reliable design of printed circuit boards.
2. The distance between the input and output terminals (including both primary and secondary DC/DC conversion) should be no less than 5 mm.
3. The layout for the control circuit and the main power circuit needs to be clearly differentiated.
4. Avoid running high current and high voltage wires in parallel with measurement and control lines.
5. Maximize the use of copper on any blank areas of the PCB.
6. For connections involving high current and high voltage, minimize the use of long-distance wire connections, as they can introduce challenging interference issues.
7. If budget permits, consider using multi-layer boards with dedicated auxiliary power and ground layers, which can significantly mitigate EMC effects.
8. The work area is particularly prone to interference, so utilize large areas of copper for wiring wherever possible.
9. In PCB design and layout, ensure that the shielding ground wiring does not form noticeable loops, as this can create an antenna effect that invites interference.
10. High-power devices should be arranged in a more organized layout to enhance the installation of the heat sink and the design of the cooling airflow path.
1. Ground Wire Design
1. Appropriately select the combination of single-point and multi-point grounding.
2. Isolate the digital circuit from the analog circuit.
3. Use the thickest ground wire feasible.
4. Form the ground wire into a closed loop.
2. Electromagnetic Compatibility Design
1. Choose an appropriate wire width.
2. Implement the correct wiring strategy.
Utilizing equal routing can help minimize wire inductance, but it may increase mutual inductance and distributed capacitance between wires. If layout permits, a grid-pattern wiring structure is preferable. Specifically, wire one side of the printed board horizontally and the other side vertically, connecting them through metallized holes at the intersections.
To mitigate crosstalk between conductors on the printed circuit board, avoid long-distance equal routing when designing the layout. Maximize spacing between wires, and minimize the crossing of signal wires over ground and power wires. Inserting a grounded trace between sensitive signal lines can effectively reduce crosstalk.
3. Decoupling Capacitor Configuration
In DC power supply circuits, load variations can introduce power supply noise. For instance, in digital circuits, transitions between states can generate large spike currents on the power line, resulting in transient noise voltage. The strategic placement of decoupling capacitors helps suppress noise from load changes, a common practice in the reliable design of printed circuit boards.
