Antenna PCBs in wireless devices are widely utilized in telecommunications for signal reception and transmission. With the emergence of 5G networks, there is an increasing demand for antenna PCBs in electronic devices, especially in applications related to the Internet of Things (IoT).
PCB board antenna refers to the part of the PCB board used for wireless reception and transmission. When transmitting, it converts the high-frequency current of the transmitter into a space electromagnetic wave; when receiving, it converts the electromagnetic wave intercepted from space into high-frequency current and sends it to the receiver. Its advantages include less space occupation, low cost, no need to separately assemble the antenna, less susceptibility to touch and damage, and ease of assembly into the whole machine. However, there are trade-offs – sacrificing performance. Disadvantages include difficulty achieving roundness in a single antenna field, high insertion loss, relatively low efficiency, and vulnerability to interference on the motherboard. The antenna PCB board material should have a high frequency, and generally, FR4 does not perform well. Materials that can be used to manufacture antenna PCBs include Rogers PCB, Teflon, Arlon, Taconic, Nelco, FR4, Dupont, and Isola. The ultimate purpose of the antenna is to radiate RF signals into free space. Therefore, antenna design is crucial. The design depends largely on the characteristics of the installed platform and is highly sensitive to the surrounding environment. In many cases, the antenna is a unique design for each platform.
Designing a PCB board antenna: antenna PCB design and RF layout are crucial components of any wireless device. Two identical RF products with different PCB antenna designs and layouts can have distinct RF performance ranges. The key differences lie in the quality and considerations in the design process. Many electronic applications operating in the ISM band at 2.4 GHz and 915 MHz require compact PCB board antennas for commercial and consumer purposes. PCB board antennas are directly printed on the circuit board. Good RF grounding is essential for optimal wireless performance, and certain design principles must be followed. When using pre-produced antennas, their characteristics depend on the connected ground plane. Impedance matching is crucial for antenna performance.
Several factors affect the performance of GPS antennas:
1) Ceramic chip: The quality of ceramic powder and sintering process directly impact its performance. Ceramic chips come in various sizes, with larger chips having a higher resonance frequency and better reception. Square designs are common to ensure uniform star collection.
2) Silver layer: The silver layer on the ceramic antenna affects the resonant frequency. The frequency point may need adjustment in a complete machine assembly to maintain optimal reception.
3) Feed point: The feed point of the ceramic antenna collects and sends the resonance signal. Impedance matching is crucial, with adjustments made in the XY direction.
4) Amplification circuit: The shape and area of the PCB board carrying the ceramic antenna impact performance. Maintaining a considerable area and uniform shape is essential for maximizing the patch antenna’s performance. The gain of the amplifier circuit must be selected in conjunction with the rear LNA gain to prevent signal saturation. SiRF’s GSC3F requirements mandate that the total gain before the signal input does not exceed 29dB to avoid self-excitation on the antenna PCB.
PCB board antenna refers to the part of the PCB board used for wireless reception and transmission. When transmitting, it converts the high-frequency current of the transmitter into a space electromagnetic wave; when receiving, it converts the electromagnetic wave intercepted from space into high-frequency current and sends it to the receiver. Its advantages include less space occupation, low cost, no need to separately assemble the antenna, less susceptibility to touch and damage, and ease of assembly into the whole machine. However, there are trade-offs – sacrificing performance. Disadvantages include difficulty achieving roundness in a single antenna field, high insertion loss, relatively low efficiency, and vulnerability to interference on the motherboard. The antenna PCB board material should have a high frequency, and generally, FR4 does not perform well. Materials that can be used to manufacture antenna PCBs include Rogers PCB, Teflon, Arlon, Taconic, Nelco, FR4, Dupont, and Isola. The ultimate purpose of the antenna is to radiate RF signals into free space. Therefore, antenna design is crucial. The design depends largely on the characteristics of the installed platform and is highly sensitive to the surrounding environment. In many cases, the antenna is a unique design for each platform.
Designing a PCB board antenna: antenna PCB design and RF layout are crucial components of any wireless device. Two identical RF products with different PCB antenna designs and layouts can have distinct RF performance ranges. The key differences lie in the quality and considerations in the design process. Many electronic applications operating in the ISM band at 2.4 GHz and 915 MHz require compact PCB board antennas for commercial and consumer purposes. PCB board antennas are directly printed on the circuit board. Good RF grounding is essential for optimal wireless performance, and certain design principles must be followed. When using pre-produced antennas, their characteristics depend on the connected ground plane. Impedance matching is crucial for antenna performance.
Several factors affect the performance of GPS antennas:
1) Ceramic chip: The quality of ceramic powder and sintering process directly impact its performance. Ceramic chips come in various sizes, with larger chips having a higher resonance frequency and better reception. Square designs are common to ensure uniform star collection.
2) Silver layer: The silver layer on the ceramic antenna affects the resonant frequency. The frequency point may need adjustment in a complete machine assembly to maintain optimal reception.
3) Feed point: The feed point of the ceramic antenna collects and sends the resonance signal. Impedance matching is crucial, with adjustments made in the XY direction.
4) Amplification circuit: The shape and area of the PCB board carrying the ceramic antenna impact performance. Maintaining a considerable area and uniform shape is essential for maximizing the patch antenna’s performance. The gain of the amplifier circuit must be selected in conjunction with the rear LNA gain to prevent signal saturation. SiRF’s GSC3F requirements mandate that the total gain before the signal input does not exceed 29dB to avoid self-excitation on the antenna PCB.
