PCB Immersion gold and gold plating are surface treatment techniques used to enhance the durability and performance of printed circuit boards (PCBs). These processes involve applying a thin gold coating to the PCB surface, offering several advantages over traditional finishes.
The PCB immersion gold process, also known as electroless immersion gold (ENIG), entails the deposition of a thicker layer through a chemical redox reaction method. It is a type of electroless nickel gold deposition that achieves a thicker gold layer. During PCB immersion gold, the board is immersed in a chemical bath containing a complexing agent and a reducing agent. As the PCB moves through the bath, gold ions and the complexing agent undergo a reaction where gold ions (Au3+) are reduced to elemental gold (Au0). This gold adheres uniformly to the PCB surface, forming a continuous gold film.
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PCB gold plating, also known as “electroplating gold,” “electroplating nickel gold plate,” “electrolytic gold,” “electric gold,” and “electronickel gold plate,” is divided into soft gold and hard gold. Hard gold is typically used for gold finger circuit board products. The process involves dissolving nickel and gold (commonly known as gold salt) in chemical solutions. The circuit board is immersed in an electroplating tank, and a current is applied to deposit nickel gold plating onto the copper foil surface of the circuit board. Electronickel gold plating, known for its high hardness, offers increased wear resistance.
1. Immersion gold has a thicker thickness compared to electroplated gold. Its surface appears more golden yellow, which enhances customer satisfaction with the finished product.
2. The crystal structure formed by immersion gold differs from that of electroplated gold. Immersion gold is easier to solder and less prone to poor welding during the welding process.
3. Immersion gold possesses a denser crystal structure and shows improved resistance to oxidation compared to electroplated gold.
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This version aims to maintain the structure and numbering of the original sentences while enhancing readability and clarity.
4. As the wiring of precision products becomes increasingly intricate, some line widths and spacings have decreased to as low as 3 mil. This can lead to gold wire short circuits during the high-precision plate’s gold plating process. Immersion gold plating, which deposits only nickel gold on the pad, prevents such short circuits. Additionally, the solder mask adheres more securely to the lines, minimizing any negative impacts during data compensation adjustments.
5. Compared to high-frequency boards with stringent demands, immersion gold plating requires superior flatness and eliminates the risk of black pad phenomena post-assembly. Importantly, immersion gold plating exhibits stronger flatness and longevity compared to traditional gold plating.
In conclusion, immersion gold and gold plating are two commonly employed surface treatment techniques for enhancing the durability and performance of PCBs. Both methods offer benefits such as improved corrosion resistance, excellent electrical conductivity, and solderability. The choice between them depends on specific application requirements and desired finishing characteristics.
The PCB immersion gold process, also known as electroless immersion gold (ENIG), entails the deposition of a thicker layer through a chemical redox reaction method. It is a type of electroless nickel gold deposition that achieves a thicker gold layer. During PCB immersion gold, the board is immersed in a chemical bath containing a complexing agent and a reducing agent. As the PCB moves through the bath, gold ions and the complexing agent undergo a reaction where gold ions (Au3+) are reduced to elemental gold (Au0). This gold adheres uniformly to the PCB surface, forming a continuous gold film.
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PCB gold plating, also known as “electroplating gold,” “electroplating nickel gold plate,” “electrolytic gold,” “electric gold,” and “electronickel gold plate,” is divided into soft gold and hard gold. Hard gold is typically used for gold finger circuit board products. The process involves dissolving nickel and gold (commonly known as gold salt) in chemical solutions. The circuit board is immersed in an electroplating tank, and a current is applied to deposit nickel gold plating onto the copper foil surface of the circuit board. Electronickel gold plating, known for its high hardness, offers increased wear resistance.
1. Immersion gold has a thicker thickness compared to electroplated gold. Its surface appears more golden yellow, which enhances customer satisfaction with the finished product.
2. The crystal structure formed by immersion gold differs from that of electroplated gold. Immersion gold is easier to solder and less prone to poor welding during the welding process.
3. Immersion gold possesses a denser crystal structure and shows improved resistance to oxidation compared to electroplated gold.
—
This version aims to maintain the structure and numbering of the original sentences while enhancing readability and clarity.
4. As the wiring of precision products becomes increasingly intricate, some line widths and spacings have decreased to as low as 3 mil. This can lead to gold wire short circuits during the high-precision plate’s gold plating process. Immersion gold plating, which deposits only nickel gold on the pad, prevents such short circuits. Additionally, the solder mask adheres more securely to the lines, minimizing any negative impacts during data compensation adjustments.
5. Compared to high-frequency boards with stringent demands, immersion gold plating requires superior flatness and eliminates the risk of black pad phenomena post-assembly. Importantly, immersion gold plating exhibits stronger flatness and longevity compared to traditional gold plating.
In conclusion, immersion gold and gold plating are two commonly employed surface treatment techniques for enhancing the durability and performance of PCBs. Both methods offer benefits such as improved corrosion resistance, excellent electrical conductivity, and solderability. The choice between them depends on specific application requirements and desired finishing characteristics.
