1. DIP is a type of inline packaging technology that utilizes the dual in-line method to package circuit boards, ultimately forming an integrated circuit. Most small-scale integrated circuits are operated using this method, typically with fewer than 100 pins. It’s also possible to directly insert pins on the CPU with a corresponding number of holes, necessitating insertion into a socket structured for DIP. Be cautious when plugging and unplugging DIP-packaged chips, as their pins are quite fragile and prone to breakage.

2. Presently, Surface Mount Technology (SMT) processing is advancing rapidly. While there’s a growing inclination to replace DIP technology, it’s premature for DIP plug-in units to entirely vanish from the processing stage. It’s crucial to recognize that within the PCBA manufacturing process, certain specialized components necessitate this approach. Hence, DIP continues to hold significance in processing. However, compared to the automation of SMT, this mode demands considerable manual labor.