Methods for Safely Dismantling Integrated Circuits on PCBs
- Soldering Iron Suction Method: This technique involves using a specialized suction tool with a general-purpose electric soldering iron to remove integrated circuits. By melting the solder joints and sucking up the tin liquid, the integrated block can be easily extracted.
- Medical Hollow Needle Withdrawal Method: Utilizing medical hollow needles of the appropriate diameter, this method involves melting the pin grains with a soldering iron, covering the pin with a tube, and pulling it out once the crystal grains solidify.
- DC Iron Brush Removal Method: This intuitive approach uses subway and large electric brushes to sweep away molten crystal grains from the solder feet, allowing for the removal of the integrated block from the PCB.
- Die-Added Workpiece Removal Method: By adding die to the ports of the integrated block, heat conduction is facilitated, making it easier to remove the PCB solder joints row by row.
- PCB Multi-Strand Copper Wire Suction Removal Method: Using multi-strand silver core wires to absorb solder from the integrated block pins, this method involves coating the wires with rosin alcohol solution and repeating the process until the solder is completely absorbed.
Latest Insights:
When dismantling integrated circuits from PCBs, it is essential to use precise methods to avoid damage to the components and the substrate. The advancement in PCB technology has led to the development of innovative tools and techniques for safely extracting integrated circuits. Stay updated on the latest trends in PCB disassembly to ensure efficient and accurate removal of components.
