One, Required Documents
1. BOM (Bill of Materials) Component List
2. No Solder Mask List
3. SMT Coordinate File
4. Device Schematic Diagram
5. Manual Soldering Component List
6. PCB Stencil File
Two, Description of Production Steps and Methods for Each Document
1. BOM Component List
2. No Solder Mask List
3. SMT Coordinate File
4. Product Silkscreen Image (recommended to be created in DXP)
(1) Top Surface Parameter Schematic Diagram
(2) Top Surface Number Schematic Diagram
(3) Bottom Surface Parameter Schematic Diagram
(4) Bottom Surface Parameter Schematic Diagram
5. Manual Soldering Component List
6. PCB Board Steel Mesh File
Three, Detailed Description of Production Steps and Methods for Each Document
1. BOM Component List
Production Method: Export from the schematic diagram and organize.
Export Method: The process is identical in Protel and DXP; DXP is recommended.
Select [Reports/Bill of Material] on the interface, then proceed with Next until Finish.
2. Non-Soldering Component List
Organize based on the component list from step one.
3. Methods and Steps for Exporting SMT Coordinate Files:
(1) Open a .PCB file by selecting [File / Open…].
(2) Click on TopLayer, then select [Edit / Select / All on Layer].
(3) Switch to BottomLayer, select [Edit / Select / All on Layer].
(4) Afterward, use Shift + Delete to remove redundant lines on both Top and Bottom sides.
(5) Choose [Design / Options…], activate the Layers button, select [Toplayer] or [BottomLayer] under Signal Layers, then pick [Top Overlay] or [BottomLayer] under Silkscreen, and set others under Keepout.
Note: For clarity, Top and Bottom layers can be disabled individually.
(6) After completing the above, pad silkscreen positions are clearly displayed.
(7) Set the origin position with [Edit / Origin / Set]. (*Ensure the PCB origin aligns with the machine’s origin.)
(8) In the export wizard, select [File/CAM Manager…], then Pick Place. Check Text, proceed with Next, select Metric units, and finish to generate a Pick Place file by pressing F9 for CAM file generation.
(9) Locate the Pick Place file in the CAM directory of the [Explorer] window on the left, right-click to export to the desired path.
(10) Open the Pick Place file with Excel and format according to SMT requirements, where Mid X and Mid Y represent SMT’s X and Y coordinates.
Note: Maintain separation of TopLayer and BottomLayer during sorting.
4. PDF File of Product Component Position Screen Printing Diagram (preferably created in DXP)
(1) Parameters for Top Surface Schematic Diagram
– Includes resistance and capacitance on the TopOverlay layer, IC details such as resistance value, capacitance value, and IC name (e.g., 10K, 1uF, MAX354).
Note: Center all parameters within the pad’s silkscreen.
Steps:
A. Open a PCB file in DXP.
B. Display only TopOverlay and KeepOutLayer.
C. Hide device numbers, show only device parameters, center each within the pad’s silkscreen, maintaining order and direction consistency.
D. Select [File / Smart PDF…] to export as PDF.
Note: For Figures 2, 3, and 4, output only TopOverlay and KeepOutLayer; left-click to select a layer, right-click to delete or add layers.
(2) Numbered Schematic Diagram for Top Surface
– Displays the numbers for resistors, capacitors, and ICs on the TopOverlay layer (e.g., R1, C1, U1).
Note: Center all numbers within the pad’s silkscreen.
Steps are identical to the first step.
(3) Parameters for Bottom Surface Schematic Diagram
– Lists resistance, capacitance, IC resistance, capacitance, and IC name on the BottomOverlay layer (e.g., 10K, 1uF, MAX354).
Note: Center all parameters within the pad’s silkscreen.
Steps are similar to those for the top surface.
(4) Numbered Schematic Diagram for Bottom Surface
– Shows the numbers for resistors, capacitors, and ICs on the BottomOverlay layer (e.g., R1, C1, U1).
Note: Center all numbers within the pad’s silkscreen.
Steps are analogous to those for the bottom surface.
5. Manual Soldering Component List
Organized according to the BOM list.
6. PCB Board Stencil File
Provided by the hardware department.
These edits aim to enhance clarity and coherence, ensuring the instructions are concise and easy to follow for PCB professionals.