Effective Measures to Reduce The Cost of Printed Circuit Board Manufacturing
1. The impact of printed circuit board size design on cost
The original size of the copper clad plate is often too large, making it difficult to process and fit into the printed circuit board processing equipment. It may need to be cut into smaller pieces before processing. The processing size should be determined based on the processing equipment, the size of each printed circuit board, and various process parameters. These parameters include the width required for screw holes, process allowances for shaping, plating, and corrosion, clamping and positioning allowances, alignment marks, and manufacturer’s marks. Recommended values for these parameters can be obtained from copper clad laminate manufacturers or distributors to optimize production.
2. The impact of the number of layers of printed circuit boards on the cost
Increasing the number of layers in printed circuit boards significantly raises production costs. Therefore, careful consideration must be given when designing complex boards. While designing a 6-layer board may be challenging and costly, exploring options like designing an 8-layer board could potentially result in cost savings and economic benefits in the long run.
3. CEM-3 material
Aside from the traditional double-sided epoxy resin glass cloth copper-clad plates, there is a cost-effective alternative known as CEM-3 material. This material replaces the thick epoxy resin glass cloth with two thin sheets sandwiching an epoxy resin glass cloth plexiglass non-woven fabric, reducing costs without compromising quality. CEM-3 material is versatile and can be used as a core material for multi-layer rigid printed circuit boards, providing flexibility and cost-effectiveness in manufacturing processes.
1. The impact of printed circuit board size design on cost
The original size of the copper clad plate is often too large, making it difficult to process and fit into the printed circuit board processing equipment. It may need to be cut into smaller pieces before processing. The processing size should be determined based on the processing equipment, the size of each printed circuit board, and various process parameters. These parameters include the width required for screw holes, process allowances for shaping, plating, and corrosion, clamping and positioning allowances, alignment marks, and manufacturer’s marks. Recommended values for these parameters can be obtained from copper clad laminate manufacturers or distributors to optimize production.
2. The impact of the number of layers of printed circuit boards on the cost
Increasing the number of layers in printed circuit boards significantly raises production costs. Therefore, careful consideration must be given when designing complex boards. While designing a 6-layer board may be challenging and costly, exploring options like designing an 8-layer board could potentially result in cost savings and economic benefits in the long run.
3. CEM-3 material
Aside from the traditional double-sided epoxy resin glass cloth copper-clad plates, there is a cost-effective alternative known as CEM-3 material. This material replaces the thick epoxy resin glass cloth with two thin sheets sandwiching an epoxy resin glass cloth plexiglass non-woven fabric, reducing costs without compromising quality. CEM-3 material is versatile and can be used as a core material for multi-layer rigid printed circuit boards, providing flexibility and cost-effectiveness in manufacturing processes.
