1. During the production process, the circuit board must undergo copper sinking, tin electroplating, and connector soldering. The materials utilized in these steps must have low resistivity to ensure low overall impedance of the circuit board, meeting product quality requirements and ensuring normal operation.
2. Tin plating is a critical step in the production of circuit boards and is susceptible to issues that can impact impedance. Common problems include discoloration (due to oxidation or deliquescence), poor solderability leading to difficult soldering, high impedance, poor electrical conductivity, and overall board performance instability.
3. The conductors on the circuit board are responsible for various signal transmissions. Changes in impedance values can occur due to factors such as etching, stack thickness, and wire width, especially when increasing frequency for higher transmission rates. These changes can distort signals and degrade circuit board performance, necessitating control of impedance within a specific range.
4. When installing components during the process, it is essential to consider electrical performance and signal transmission issues. Lower impedance is preferred at this stage to optimize performance.
WellCircuits Limited specializes in manufacturing high-precision double-sided, multi-layer, impedance-controlled, blind/buried vias, and thick copper circuit boards. Their product range includes HDI, thick copper, backplanes, rigid-flex, buried capacitance, buried resistance, Golden Finger, and other types of circuit boards to meet diverse customer needs.
