1. Under the premise of cost permitting, increasing the number of grounding layers and placing the signal layer close to the grounding layer can effectively mitigate EMI radiation. This strategy is particularly beneficial for high-speed PCBs where the power plane and ground plane are tightly coupled. Such coupling minimizes power supply impedance, consequently diminishing EMI emissions.

2. Layout

3. A well-considered layout, aligned with the flow of signal currents, plays a pivotal role in minimizing signal interference and controlling EMI. Therefore, achieving a reasonable layout is paramount in EMI management. Key principles guiding the layout process include: