High-current, high-power circuits should be avoided as far as possible in the central area of the board, and the effects of heat dissipation and radiation should be considered.

The connector should be arranged on one side of the board as far as possible and far away from the high-frequency circuit.

The input/output circuit should be placed close to the corresponding connector, with the decoupling capacitor positioned near the corresponding power pin.

Fully consider the feasibility of the layout for power supply division. Multi-power devices should be placed across the boundary of the power supply division area to effectively reduce the impact of plane division on EMI.