The links and production processes involved in PCBA processing are intricate, and issues in any single link can trigger a chain reaction, making quality control crucial. The following outlines the production and processing quality control measures employed by PCBA manufacturers, highlighting the key aspects of quality control.

1. Overview of PCBA Manufacturer’s Production and Processing Quality Control

1. Process Analysis

Attention is required right from the moment the processing order is received. Initially, a process analysis is conducted based on the PCBGerber file, followed by the provision of a manufacturability report.

2. Incoming Inspection

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If you aim to produce high-quality PCBA, it’s essential to control quality starting with the raw materials. Attention must be given to the quality inspection of components, particularly for PCBA foundry materials, which should be closely monitored during procurement. Sourcing components from reputable traders, distributors, and original manufacturers is crucial to ensure component quality. The use of refurbished or counterfeit components can significantly impact product quality, which is especially critical for PCBA foundry orders. Typically, PCBA manufacturers provide after-sales commitments for these orders. Component issues not only increase our costs but also create problems for customers. The PCB should be assessed for reflow oven temperature, potential blockages or leaks in fly-line vias, and any warping of the board surface. Additionally, it’s important to verify that the IC screen printing matches the BOM, while storing components in controlled temperature and humidity conditions. Other commonly used materials should also be inspected for screen printing quality, appearance, and power-on measurements.

3. SMT Patch Processing

Solder paste printing and reflow oven temperature control are key aspects of assembly, requiring high-quality laser stencils and precise processing. Strict adherence to AOI testing can significantly minimize defects caused by human error.

4. Plug-In

In the plug-in stage, mold design for wave soldering is critical.

5. Quiz

For orders with testing requirements, the main tests conducted by PCBA manufacturers typically include ICT (circuit test), FCT (functional test), burn tests (aging tests), temperature and humidity tests, and drop tests.

PCBA Processing

Next, let’s explore the key quality control links in PCBA processing.

1. SMT Patch Processing

Systematic quality control in solder paste printing and reflow soldering temperature management is crucial in the SMT chip processing production process. High-precision printing necessitates laser stencils that meet stringent quality standards. Accurate temperature control during reflow soldering is vital for solder paste wetting and bonding strength. Adjustments based on SOP operations can reduce defects during SMT processing. Conducting AOI testing rigorously in this phase also enhances quality control outcomes.

2. DIP Plug-In

DIP plug-ins typically represent the latter part of the PCBA processing sequence. Traditional components that cannot be easily converted to chip forms are inserted at this stage, where fixture quality during the furnace process is paramount. Maximizing yield and minimizing poor soldering issues, such as excessive or insufficient solder, is a long-term goal for processing plants.

3. Programming

When feasible, collaborate with customers to obtain the back-end program and subsequently load the PCBA program onto the core master IC using a burner. This approach enables concise circuit board testing through touch actions, allowing for timely identification of any defects in the entire PCBA.

4. PCBA Test

For certain PCBA foundry orders, customers may require product testing to ensure quality. Typical tests include ICT (circuit test), FCT (functional test), burn tests (aging tests), temperature and humidity tests, and drop tests.

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