How to Improve High-Precision Technology of Printed Circuit Boards?
The printed circuit board is a high-tech technology, and precise positioning of the production circuit is crucial. The production of circuit boards with buried and blind hole structures requires multiple pressing, drilling, and hole plating to complete. Therefore, it is recommended to focus on precise positioning from the start. Let’s discuss how to enhance high-precision technology.
In addition to increasing the number of wirings on the board, buried, blind, and through-hole technology play a significant role in boosting the density of the circuit board.
Buried and blind holes are typically tiny in size. By utilizing buried and blind vias for the “nearest” inter-layer interconnection, the number of through-holes is greatly reduced. Consequently, the isolation disk settings are also reduced, leading to an increase in the number of effective wirings and inter-layer interconnections on the board. This improves interconnection and enhances the high-density of the board.
Hence, a multi-layer board incorporating buried, blind, and through holes can achieve an interconnection density at least three times higher than that of a conventional full-through hole structure. Furthermore, with the same technical specifications, combining buried, blind, and through holes significantly reduces the size of the circuit board or cuts down the number of layers required.
As a result, circuit boards are increasingly utilized in high-density printed boards for external devices. Buried and blind hole technologies are not only prevalent in external device printed boards found in large computers, communication equipment, etc., but are also widely applied in civil and industrial sectors. These technologies have even made their way into thinner boards.
WellCircuits Limited is a leading manufacturer specializing in the production of high-precision double-sided, multi-layer, and impedance-controlled circuit boards with blind buried vias and thick copper. Our product range includes HDI, thick copper, backplanes, rigid-flex combinations, buried capacitance and resistance, Golden Finger, and various other types of circuit boards to cater to the diverse needs of our customers.
The printed circuit board is a high-tech technology, and precise positioning of the production circuit is crucial. The production of circuit boards with buried and blind hole structures requires multiple pressing, drilling, and hole plating to complete. Therefore, it is recommended to focus on precise positioning from the start. Let’s discuss how to enhance high-precision technology.
In addition to increasing the number of wirings on the board, buried, blind, and through-hole technology play a significant role in boosting the density of the circuit board.
Buried and blind holes are typically tiny in size. By utilizing buried and blind vias for the “nearest” inter-layer interconnection, the number of through-holes is greatly reduced. Consequently, the isolation disk settings are also reduced, leading to an increase in the number of effective wirings and inter-layer interconnections on the board. This improves interconnection and enhances the high-density of the board.
Hence, a multi-layer board incorporating buried, blind, and through holes can achieve an interconnection density at least three times higher than that of a conventional full-through hole structure. Furthermore, with the same technical specifications, combining buried, blind, and through holes significantly reduces the size of the circuit board or cuts down the number of layers required.
As a result, circuit boards are increasingly utilized in high-density printed boards for external devices. Buried and blind hole technologies are not only prevalent in external device printed boards found in large computers, communication equipment, etc., but are also widely applied in civil and industrial sectors. These technologies have even made their way into thinner boards.
WellCircuits Limited is a leading manufacturer specializing in the production of high-precision double-sided, multi-layer, and impedance-controlled circuit boards with blind buried vias and thick copper. Our product range includes HDI, thick copper, backplanes, rigid-flex combinations, buried capacitance and resistance, Golden Finger, and various other types of circuit boards to cater to the diverse needs of our customers.
