According to the current situation, lead-free environmental protection is the topic that PCB and PCBA manufacturers discuss how to improve the most. It is also a technical challenge for manufacturing. WellCircuits has spent a lot of effort in conducting research and discussion on PCB prototyping design, and has made the following progress:
1. Improvement of the establishment of the package library:
Due to the increase in lead-free soldering temperature, the influence of the device pad on the soldering point temperature must be considered when building a library. It is necessary to conduct experiments on the reliability of soldering and the heat resistance of the device to ensure that the size and shape of the pad, the size and shape of the solder mask, and the relationship between the stencil and the pad can meet the best soldering temperature.
2. Design methods and details processing:
To avoid welding tombstones, the heating of the devices should be considered in the design to ensure that each device is heated evenly. Software has been specially developed to ensure the thermal balance of the device.
3. The choice of surface treatment method:
Different surface treatment methods have different costs and processing difficulty, so there are different surface treatment methods for different products. Some surface treatment methods have subtle differences in packaging or design. For example, when OSP is adopted as the surface treatment method, the ICT test point needs to open the steel mesh, while other surface treatment methods do not have this requirement.
4. Identification description:
On the board that needs to be lead-free, identification symbols should be added for subsequent processing manufacturers to facilitate identification and processing.
WellCircuits Limited is a manufacturer specializing in the production of high-precision double-sided, multi-layer, and impedance-controlled, blind buried vias, and thick copper circuit boards. The products cover HDI, thick copper, backplanes, rigid-flex combinations, buried capacitance and resistance, Golden Finger, and other types of circuit boards, which can meet the needs of customers for various products.
1. Improvement of the establishment of the package library:
Due to the increase in lead-free soldering temperature, the influence of the device pad on the soldering point temperature must be considered when building a library. It is necessary to conduct experiments on the reliability of soldering and the heat resistance of the device to ensure that the size and shape of the pad, the size and shape of the solder mask, and the relationship between the stencil and the pad can meet the best soldering temperature.
2. Design methods and details processing:
To avoid welding tombstones, the heating of the devices should be considered in the design to ensure that each device is heated evenly. Software has been specially developed to ensure the thermal balance of the device.
3. The choice of surface treatment method:
Different surface treatment methods have different costs and processing difficulty, so there are different surface treatment methods for different products. Some surface treatment methods have subtle differences in packaging or design. For example, when OSP is adopted as the surface treatment method, the ICT test point needs to open the steel mesh, while other surface treatment methods do not have this requirement.
4. Identification description:
On the board that needs to be lead-free, identification symbols should be added for subsequent processing manufacturers to facilitate identification and processing.
WellCircuits Limited is a manufacturer specializing in the production of high-precision double-sided, multi-layer, and impedance-controlled, blind buried vias, and thick copper circuit boards. The products cover HDI, thick copper, backplanes, rigid-flex combinations, buried capacitance and resistance, Golden Finger, and other types of circuit boards, which can meet the needs of customers for various products.
