Improving Multilayer Board Lamination Quality through Organic Parameter Matching

To enhance the quality of multilayer board lamination, a crucial aspect involves the organic matching of lamination parameters, specifically temperature, pressure, and time.

1. Temperature Parameters:

  • Melting Temperature: Initiates resin melting at 70°C, crucial for resin flow.
  • Curing Temperature: Reaches 160-170°C, marking the resin’s solidification point.
  • Heating Rate: Controls temperature rise, affecting resin fluidity, with rates tailored to different PP types.

2. Pressure Parameters:

  • Pressure ensures resin fills voids between layers and expels interlayer gases.
  • Non-vacuum presses utilize general or two-stage pressurization; vacuum presses employ two-stage or multi-stage pressurization.
  • Pressure is determined based on supplier specifications, typically ranging from 15-35kg/cm2.

3. Time Parameters:

  • Crucial for lamination timing and gel time control.
  • Two-stage and multi-stage lamination requires precise control of main pressure timing.
  • Early main pressure can lead to resin extrusion, while late application may cause defects like voids or bubbles.

Conclusion: Achieving optimal multilayer lamination hinges on the organic alignment of “temperature, pressure, and time” parameters. Fine-tuning these parameters based on PP combinations, suppliers, and model characteristics ensures the production of high-quality laminates.

Leave a Comment

Contact

WellCircuits
More than PCB

Upload your GerberFile(7z,rar,zip)