For electronic equipment, a certain amount of heat is generated during operation, causing the internal temperature to rise rapidly. Failure to dissipate this heat in a timely manner can lead to overheating, resulting in device failure and decreasing the reliability of the equipment’s performance. Therefore, it is crucial to implement effective heat dissipation treatments on PCBs.
1. Incorporate heat-dissipating copper foil and utilize copper foil with a larger area for power supply.
2. Thermal vias play a critical role in heat dissipation. They can effectively lower the device’s junction temperature, enhance temperature uniformity across the board thickness, and create opportunities for employing additional heat dissipation methods on the PCB’s backside. Simulation studies have demonstrated that thermal vias with a thermal power consumption of 2.5W, a 1mm pitch, and a 6×6 center design can reduce the junction temperature by approximately 4.8°C compared to non-thermal vias. Furthermore, the temperature difference between the top and bottom of the PCB is reduced from 21°C to 5°C. It is important to note that changing the thermal via array to 4×4 resulted in a 2.2°C increase in the device’s junction temperature compared to the 6×6 configuration.
3. Expose copper on the back of the IC to minimize thermal resistance between the copper layer and the surrounding air.
4. Pay close attention to PCB layout considerations, especially for high-power and thermally sensitive devices.
1. Incorporate heat-dissipating copper foil and utilize copper foil with a larger area for power supply.
2. Thermal vias play a critical role in heat dissipation. They can effectively lower the device’s junction temperature, enhance temperature uniformity across the board thickness, and create opportunities for employing additional heat dissipation methods on the PCB’s backside. Simulation studies have demonstrated that thermal vias with a thermal power consumption of 2.5W, a 1mm pitch, and a 6×6 center design can reduce the junction temperature by approximately 4.8°C compared to non-thermal vias. Furthermore, the temperature difference between the top and bottom of the PCB is reduced from 21°C to 5°C. It is important to note that changing the thermal via array to 4×4 resulted in a 2.2°C increase in the device’s junction temperature compared to the 6×6 configuration.
3. Expose copper on the back of the IC to minimize thermal resistance between the copper layer and the surrounding air.
4. Pay close attention to PCB layout considerations, especially for high-power and thermally sensitive devices.
